Micron technology, inc. (20240186298). DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
Contents
- 1 DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Discontinuous Bonding Technology for Semiconductor Devices
- 1.13 Original Abstract Submitted
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
Scott D. Schellhammer of Meridian ID (US)
Vladimir Odnoblyudov of Eagle ID (US)
Jeremy S. Frei of Boise ID (US)
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186298 titled 'DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
Simplified Explanation
This patent application discloses semiconductor devices with discontinuous bonds, where solid-state transducers are bonded to substrates with a discontinuous bond.
- The device includes a first substrate and a second substrate, with at least one substrate having solid-state transducers.
- The second substrate has projections and intermediate regions, bonded to the first substrate with a discontinuous bond.
- Solid-state transducers are placed within the intermediate regions and bonded to the ends of these regions.
- The innovation lies in the use of a discontinuous bond for semiconductor devices.
Key Features and Innovation
- Semiconductor devices with discontinuous bonds.
- Solid-state transducers bonded to substrates with a discontinuous bond.
- Use of projections and intermediate regions for bonding.
- Individual transducers placed within intermediate regions for effective bonding.
Potential Applications
This technology can be applied in:
- Semiconductor manufacturing
- Electronics industry
- Sensor devices
Problems Solved
- Improved bonding in semiconductor devices
- Enhanced reliability and performance of devices
- Efficient integration of solid-state transducers
Benefits
- Stronger and more reliable bonds
- Enhanced device performance
- Cost-effective manufacturing process
Commercial Applications
- "Discontinuous Bonding Technology for Semiconductor Devices" can revolutionize the semiconductor industry by providing more reliable and efficient bonding solutions for various electronic devices.
Prior Art
No prior art information available at the moment.
Frequently Updated Research
No frequently updated research available at the moment.
Questions about Discontinuous Bonding Technology for Semiconductor Devices
Question 1
How does the discontinuous bond in semiconductor devices improve device performance?
The discontinuous bond in semiconductor devices enhances device performance by providing a strong and reliable connection between solid-state transducers and substrates, ensuring efficient operation and longevity of the devices.
Question 2
What are the potential cost savings associated with using discontinuous bonds in semiconductor devices?
Using discontinuous bonds in semiconductor devices can lead to cost savings by reducing the need for expensive bonding materials and processes, while still maintaining high performance and reliability levels.
Original Abstract Submitted
discontinuous bonds for semiconductor devices are disclosed herein. a device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. the second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein.
