International business machines corporation (20240178127). ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract
Contents
- 1 ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does the technology of isolated self-aligned super vias compare to traditional via structures in terms of performance and reliability?
- 1.9.3 What are the potential cost implications of implementing isolated self-aligned super vias in semiconductor manufacturing processes?
- 1.10 Original Abstract Submitted
ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
Organization Name
international business machines corporation
Inventor(s)
Koichi Motoyama of Clifton Park NY (US)
Ruilong Xie of Niskayuna NY (US)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178127 titled 'ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
Simplified Explanation
The abstract describes a patent application related to isolated self-aligned super vias, which includes a super via structure, a metallic line, and a dielectric fill material.
- Super via device comprises super via structure, metallic line, and dielectric fill material.
- Dielectric fill material located between sidewalls of super via structure and metallic line.
Potential Applications
The technology of isolated self-aligned super vias can be applied in various fields such as semiconductor manufacturing, integrated circuits, and electronic devices requiring high-density interconnects.
Problems Solved
1. Improved electrical performance and signal integrity in high-density interconnects. 2. Enhanced reliability and durability of electronic devices due to better isolation and alignment of super vias.
Benefits
1. Increased efficiency in signal transmission and reduced signal loss. 2. Higher packing density of components on a chip leading to smaller and more powerful electronic devices. 3. Enhanced thermal management due to improved electrical connections.
Potential Commercial Applications
Optimizing High-Density Interconnects with Isolated Self-Aligned Super Vias
Possible Prior Art
Prior art related to self-aligned vias and high-density interconnects in semiconductor devices may exist, but specific examples are not provided in this context.
Unanswered Questions
How does the technology of isolated self-aligned super vias compare to traditional via structures in terms of performance and reliability?
The technology of isolated self-aligned super vias offers improved electrical performance, signal integrity, and reliability compared to traditional via structures. The dielectric fill material between the sidewalls of the super via structure and the metallic line helps in better isolation and alignment, leading to enhanced overall performance.
What are the potential cost implications of implementing isolated self-aligned super vias in semiconductor manufacturing processes?
The implementation of isolated self-aligned super vias may involve additional fabrication steps and materials, which could potentially increase manufacturing costs. However, the benefits of improved performance, reliability, and efficiency may outweigh the added costs in certain applications. Further cost-benefit analysis and optimization of fabrication processes are necessary to determine the overall economic impact of this technology.
Original Abstract Submitted
one or more systems, devices, and/or methods of fabrication provided herein relate to isolated self-aligned super vias. according to one embodiment, a super via device can comprise a super via structure, a metallic line and a dielectric fill material located between the sidewalls of the super via structure and the metallic line.
