Intel corporation (20240194552). FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract
Contents
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
Organization Name
Inventor(s)
Bernd Waidhas of Pettendorf (DE)
Thomas Wagner of Regelsbach (DE)
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194552 titled 'FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
Simplified Explanation: This patent application discloses a semiconductor device and method that includes peripheral devices like capacitors or inductors. These peripheral devices are the same thickness as the die or die assembly, and are integrated into the semiconductor devices using a fan out process.
- The patent application introduces a method of including peripheral devices, such as capacitors or inductors, into a semiconductor package.
- The peripheral devices are designed to be substantially the same thickness as the die or die assembly, allowing for seamless integration.
- The integration process involves a fan out process, which helps in forming the semiconductor devices efficiently.
Potential Applications: This technology can be applied in the semiconductor industry for the development of advanced semiconductor devices with integrated peripheral devices. It can also be used in various electronic devices where space-saving and efficient integration of components are crucial.
Problems Solved: This technology addresses the challenge of integrating peripheral devices into semiconductor packages without increasing the overall thickness of the package. It provides a solution for creating compact and high-performance semiconductor devices.
Benefits: The integration of peripheral devices into semiconductor packages can lead to improved performance, reduced footprint, and enhanced functionality of electronic devices. It also simplifies the manufacturing process and reduces costs associated with assembly.
Commercial Applications: This technology has commercial applications in the semiconductor industry for the production of advanced semiconductor devices with integrated peripheral devices. It can also be utilized in consumer electronics, automotive electronics, and other industries where compact and efficient electronic components are required.
Prior Art: Prior art related to this technology may include patents or research papers on semiconductor packaging techniques, integration of peripheral devices, and fan out processes in semiconductor manufacturing.
Frequently Updated Research: Researchers are constantly exploring new methods and materials for integrating peripheral devices into semiconductor packages to enhance the performance and functionality of electronic devices.
Questions about Semiconductor Device Integration: 1. How does the integration of peripheral devices into semiconductor packages impact the overall performance of electronic devices? 2. What are the key challenges in integrating peripheral devices that are the same thickness as the die or die assembly into semiconductor devices?
Original Abstract Submitted
a semiconductor device and method of including peripheral devices into a package is disclosed. in one example, a peripheral device includes a passive device such as a capacitor or an inductor. examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. examples are further shown that use this configuration in a fan out process to form semiconductor devices.
