Intel corporation (20240186263). STRUCTURE AND PROCESS FOR WARPAGE REDUCTION simplified abstract
Contents
- 1 STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STRUCTURE AND PROCESS FOR WARPAGE REDUCTION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Frequently Updated Research
- 1.12 Original Abstract Submitted
STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
Organization Name
Inventor(s)
Hong Seung Yeon of Chandler AZ (US)
Whitney Bryks of Tempe AZ (US)
Jung Kyu Han of Chandler AZ (US)
STRUCTURE AND PROCESS FOR WARPAGE REDUCTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186263 titled 'STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
Simplified Explanation
The present disclosure is directed to a semiconductor carrier platform with a support panel that has a top surface and a bottom surface, where the top surface serves as a working surface for assembling IC packages using panel-level packaging technology. In one aspect, a backside molding layer is positioned on the bottom surface of the support panel to prevent or correct any panel warpage. In another aspect, a removable film may be placed between the bottom surface of the support panel and the backside molding layer to facilitate easy cleaning and reusability of the support panel.
- Support panel with top and bottom surfaces
- Top surface used for assembling IC packages
- Backside molding layer to prevent or correct panel warpage
- Removable film for easy cleaning and reusability
Potential Applications
This technology could be applied in the semiconductor industry for efficient and cost-effective panel-level packaging of IC packages.
Problems Solved
1. Panel warpage prevention or correction 2. Easy cleaning and reusability of support panel
Benefits
1. Cost-effective panel-level packaging 2. Improved efficiency in semiconductor assembly processes
Potential Commercial Applications
Optimizing semiconductor assembly processes with panel-level packaging technology
Possible Prior Art
There may be existing technologies or methods for preventing panel warpage in semiconductor carrier platforms, but the use of a removable film for easy cleaning and reusability could be a novel feature.
Unanswered Questions
How does this technology compare to traditional methods of semiconductor packaging?
This technology offers the advantage of panel-level packaging, which can potentially increase efficiency and cost-effectiveness. However, further comparative studies would be needed to fully assess its benefits.
Are there any limitations to the reusability of the support panel with the removable film?
While the removable film allows for easy cleaning and reusability, there may be factors such as wear and tear or material degradation that could limit the number of reuse cycles. Further research and testing would be required to determine the longevity of the support panel with the removable film.
Frequently Updated Research
There may be ongoing research in the semiconductor industry related to panel-level packaging technologies and methods for improving efficiency and cost-effectiveness in semiconductor assembly processes. Researchers and industry professionals may be conducting studies on the use of support panels with innovative features such as backside molding layers and removable films.
Original Abstract Submitted
the present disclosure is directed to a semiconductor carrier platform having a support panel with a top surface and a bottom surface, with the top surface providing a working surface for assembling ic packages using panel-level packaging technology. in an aspect, a backside molding layer may be positioned on the bottom surface of the support panel to prevent or correct any panel warpage. in another aspect, a removable film may be positioned between the bottom surface of the support panel and the backside molding layer to allow the support panel to be readily cleaned and reused.
