Intel corporation (20240178162). INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract

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INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE

Organization Name

intel corporation

Inventor(s)

Jeremy Ecton of Gilbert AZ (US)

Aleksandar Aleksov of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240178162 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE

Simplified Explanation

The abstract describes an integrated circuit (IC) package substrate with a glass core containing a cavity filter structure.

  • Glass core with cavity filter structure:
   * The IC package substrate includes a core made of glass.
   * The core has a first core portion with a trench and a ridge lined with conductive material on the first surface.
   * A second core portion has a second surface lined with conductive material.
   * The first surface of the first core portion is physically coupled to the second surface of the second core portion, forming a cavity filter structure.

Potential Applications

The technology could be used in:

  • High-frequency communication devices
  • Radar systems
  • Wireless communication systems

Problems Solved

  • Improved signal filtering and interference reduction
  • Enhanced performance of electronic devices
  • Miniaturization of components

Benefits

  • Higher signal quality
  • Increased efficiency
  • Compact design

Potential Commercial Applications

      1. Enhancing Signal Filtering in Electronic Devices ###

Possible Prior Art

There may be prior art related to glass core substrates in electronic packaging, but specific details are not provided in this abstract.

Unanswered Questions

What materials are used for the conductive lining in the glass core?

The abstract does not specify the exact materials used for the conductive lining on the glass core. Further details on this aspect would be beneficial for a comprehensive understanding of the technology.

How does the cavity filter structure improve the performance of the IC package substrate?

While the abstract mentions the formation of a cavity filter structure, it does not elaborate on how this structure enhances the functionality or performance of the IC package substrate. More information on this aspect would provide insights into the innovation's significance.


Original Abstract Submitted

an integrated circuit (ic) package substrate including a glass core having a cavity filter structure, and related devices and methods, are disclosed herein. in some embodiments, an ic package substrate may include a core made of glass, and the core including a first core portion having a first surface and a trench and a ridge in the first surface, the trench and the ridge lined with a conductive material; and a second core portion having a second surface, the second surface lined with the conductive material, wherein the first surface of the first core portion is physically coupled to the second surface of the second core portion forming a cavity filter structure.

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