IBIDEN CO., LTD. Patent Application Trends in 2025

IBIDEN CO., LTD. patent applications in 2025

Top 10 Technology Areas

• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 5 patents
  • Example: 20250008651. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H01M10/658 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
  • Count: 3 patents
  • Example: 20250070319. HEAT TRANSFER SUPPRESSION SHEET AND BATTERY PACK (IBIDEN CO., LTD.)
• H05K2201/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 3 patents
  • Example: 20250008645. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K2201/0338 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 3 patents
  • Example: 20250008645. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K3/16 (by cathodic sputtering)
  • Count: 3 patents
  • Example: 20250008651. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H01M50/293 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
  • Count: 2 patents
  • Example: 20250070350. HEAT TRANSFER SUPPRESSION SHEET AND BATTERY PACK (IBIDEN CO., LTD.)
• H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 2 patents
  • Example: 20250008645. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K3/4038 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 2 patents
  • Example: 20250008652. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K2201/096 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 2 patents
  • Example: 20250048562. WIRING SUBSTRATE (IBIDEN CO., LTD.)
• D04H1/72 (the fibres being randomly arranged)
  • Count: 1 patents
  • Example: 20250034770. INORGANIC FIBER MAT (IBIDEN CO., LTD.)

Emerging Technology Areas

• H05K2201/09827 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 1 patents
  • Example: 20250056718. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K3/188 (using precipitation techniques to apply the conductive material)
  • Count: 1 patents
  • Example: 20250056718. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K1/0373 (Use of materials for the substrate)
  • Count: 1 patents
  • Example: 20250056718. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H01M10/647 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
  • Count: 1 patents
  • Example: 20250055077. HEAT TRANSFER SUPPRESSION SHEET, PRODUCTION METHOD THEREFOR, AND BATTERY PACK (IBIDEN CO., LTD.)
• H01M2220/20 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
  • Count: 1 patents
  • Example: 20250062445. HEAT TRANSFER SUPPRESSION SHEET AND BATTERY PACK (IBIDEN CO., LTD.)
• H05K2201/2081 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 1 patents
  • Example: 20250081334. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K1/0296 ({Conductive pattern lay-out details not covered by sub groups)
  • Count: 1 patents
  • Example: 20250081334. PRINTED WIRING BOARD (IBIDEN CO., LTD.)
• H05K2203/143 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 1 patents
  • Example: 20250048562. WIRING SUBSTRATE (IBIDEN CO., LTD.)
• H05K2203/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 1 patents
  • Example: 20250048562. WIRING SUBSTRATE (IBIDEN CO., LTD.)
• H05K2203/0789 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
  • Count: 1 patents
  • Example: 20250048562. WIRING SUBSTRATE (IBIDEN CO., LTD.)

Top Inventors

• Naoyuki JIMBO (4 patents)
• Susumu KAGOHASHI (3 patents)
• Jun SAKAI (3 patents)
• Shohei SHIMADA (2 patents)
• Naoki ONAYA (2 patents)
• Masashi KUWABARA (2 patents)
• Kyohei YOSHIKAWA (2 patents)
• Tomohisa YAMAZAKI (1 patent)
• Takahiko OKABE (1 patent)
• Hiroaki TAKEUCHI (1 patent)

Patent Categories

Geographical Distribution of Inventors

Geographical Distribution of US Inventors

IBIDEN CO., LTD. Inventor States 2025 - Up to February 2025