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Category:H05K1/18
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Pages in category "H05K1/18"
The following 200 pages are in this category, out of 345 total.
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- 17383241. PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD simplified abstract (QUALCOMM Incorporated)
- 17621252. DISPLAY MODULE AND SEAMLESS SPLICING DISPLAY DEVICE simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17709920. INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17815838. CONFIGURABLE CARD CONNECTOR simplified abstract (Dell Products L.P.)
- 17818722. ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17825508. BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17828501. ULTRAVIOLET (UV) LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)
- 17849453. LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE simplified abstract (Microsoft Technology Licensing, LLC)
- 17867016. WIRELESS POWER TRANSMISSION APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17870977. ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17873385. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17877729. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 17887834. ELECTRONIC DEVICE INCLUDING CONDUCTIVE FIXING MEMBER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17894070. SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT simplified abstract (Micron Technology, Inc.)
- 17908759. Circuit Board, Electronic Device, and Production Method for Circuit Board simplified abstract (HONOR DEVICE CO., LTD.)
- 17911345. ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)
- 17912531. FLEXIBLE BATTERY, CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17914644. CURVED SCREEN BENDING DEVICE AND CURVED SCREEN BENDING METHOD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17915707. DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17927576. WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (BOE Technology Group Co., Ltd.)
- 17955796. EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17956383. Compact Optical System For A VCSEL Based Laser Aim Pattern Generator simplified abstract (ZEBRA TECHNOLOGIES CORPORATION)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17957697. ELECTRONIC DEVICE INCLUDING COIN-CELL BATTERY simplified abstract (Samsung Electronics Co., Ltd.)
- 17965378. SPEAKER WITH POROUS SHEET AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17992543. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17994058. ELECTRONIC DEVICE INCLUDING CABLE CONNECTOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18016679. Display Module and Display Device simplified abstract (BOE Technology Group Co., Ltd.)
- 18016845. DISPLAY APPARATUS AND METHOD FOR DRIVING DISPLAY APPARATUS simplified abstract (BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.)
- 18016845. DISPLAY APPARATUS AND METHOD FOR DRIVING DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18022379. DISPLAY MODULE AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18022379. DISPLAY MODULE AND DISPLAY DEVICE simplified abstract (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 18022418. DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18083033. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18085775. ELECTRONIC DEVICE AND METHOD OF ESTIMATING BODY TEMPERATURE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18089489. SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION simplified abstract (Intel Corporation)
- 18089877. INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS simplified abstract (Intel Corporation)
- 18090214. ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18122891. VOLTAGE REGULATOR MODULE HAVING A POWER STAGE simplified abstract (Infineon Technologies Austria AG)
- 18124101. SYSTEMS, APPARATUSES, METHODS, AND NON-TRANSITORY COMPUTER-READABLE STORAGE DEVICES FOR DE-SERIALIZING AND SERIALIZING DATA TRANSMISSION simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18147270. ANTENNA MODULE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE ANTENNA MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18148017. FASTENER AND SEALANT simplified abstract (LEAR CORPORATION)
- 18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18161394. ANTENNA HAVING SINGLE NON-CONDUCTIVE PORTION AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18164788. CIRCUIT BOARD HAVING ELECTROMAGNETIC SHIELDING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18171083. ROUGHNESS EDGE OF A HEAT SINK simplified abstract (Dell Products L.P.)
- 18173767. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18181929. SIGNAL TRANSMISSION DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18181929. SIGNAL TRANSMISSION DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18188297. ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT simplified abstract (Intel Corporation)
- 18191787. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18213005. ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18221430. CONTROL CIRCUIT AND POWER SUPPLY DEVICE simplified abstract (SHARP KABUSHIKI KAISHA)
- 18221893. DISPLAY DEVICE AND METHOD OF DRIVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18243250. COMPOSITE ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18263271. Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18273222. WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE simplified abstract (KYOCERA Corporation)
- 18273277. TOUCH DISPLAY DEVICE AND DISPLAY SYSTEM simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18273277. TOUCH DISPLAY DEVICE AND DISPLAY SYSTEM simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 18278967. ELECTRONIC SUBSTRATE simplified abstract (LG INNOTEK CO., LTD.)
- 18293247. ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE simplified abstract (KYOCERA Corporation)
- 18331759. SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT simplified abstract (CANON KABUSHIKI KAISHA)
- 18336096. FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18352580. WEARABLE ELECTRONIC DEVICE COMPRISING DAMPING STRUCTURE OF CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18357379. SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT simplified abstract (Western Digital Technologies, Inc.)
- 18364578. DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18372990. DISPLAY APPARATUS simplified abstract (Samsung Display Co., LTD.)
- 18373776. CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18382321. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18387351. FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18397108. FLEXIBLE DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18405268. ELECTRONIC DEVICE COMPRISING CAMERA MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18417033. CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A LIGHTING SYSTEM WITH LED LIGHTS simplified abstract (Musco Corporation)
- 18418513. RADIO FREQUENCY FRONT-END STRUCTURES simplified abstract (Intel Corporation)
- 18420769. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJIFILM Corporation)
- 18432021. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18435032. STRETCHABLE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18438124. CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18441334. APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18442812. METHOD OF HUB COMMUNICATION, PROCESSING, STORAGE AND DISPLAY simplified abstract (Cilag GmbH International)
- 18444152. SPEAKER simplified abstract (ALPS ALPINE CO., LTD.)
- 18446820. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18453682. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18453682. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18455234. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18461268. SEMICONDUCTOR DEVICE AND CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18464259. CHIP ON FILMS AND DISPLAY MODULES simplified abstract (Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.)
- 18465803. LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE simplified abstract (NICHIA CORPORATION)
- 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18475392. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18483870. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18483884. CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18506538. Electronic Device simplified abstract (SEIKO EPSON CORPORATION)
- 18514973. IMAGE FORMING APPARATUS AND CIRCUIT BOARD FOR IMAGE FORMING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18520338. DISPLAY DEVICE, PHOTOMASK, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18523280. INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18524845. PANEL ALIGNMENT DEVICE AND PANEL ALIGNMENT METHOD FOR DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18524932. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18526389. MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING MULTILAYER ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18529346. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18538822. WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18542843. ELECTRONIC MODULE AND CONTACT ARRANGEMENT simplified abstract (Robert Bosch GmbH)
- 18543094. COIL DEVICE simplified abstract (TDK CORPORATION)
- 18546796. CIRCUIT BOARD HAVING COMPOSITE MAGNETIC COMPONENTS MOUNTED THEREON simplified abstract (LG INNOTEK CO., LTD.)
- 18547999. MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL ARRAY AND FABRICATION METHOD simplified abstract (THE REGENTS OF THE UNIVERSITY OF CALIFORNIA)
- 18551598. ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (SONY GROUP CORPORATION)
- 18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 18560671. CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18564139. POWER CONVERSION DEVICE simplified abstract (Hitachi Astemo, Ltd.)
- 18577077. CIRCUIT BOARD simplified abstract (LG INNOTEK CO., LTD.)
- 18585498. BARRIER LAYER FOR AN ELECTRICAL DEVICE simplified abstract (Honeywell International Inc.)
- 18587832. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJIFILM Corporation)
- 18588294. SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER simplified abstract (NEC Corporation)
- 18588633. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18588800. System and method for determining product count information using magnetic sensors simplified abstract (7-Eleven, Inc.)
- 18594754. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18595991. FLOW SENSING DEVICE AND ASSOCIATED METHOD simplified abstract (Honeywell International Inc.)
- 18598579. ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18602648. POWER SUPPLY SYSTEM, RADIO FREQUENCY SYSTEM, COMMUNICATION DEVICE, AND TRACKER MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18603113. METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS simplified abstract (STMicroelectronics International N.V.)
- 18609928. APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED SYSTEMS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18610035. POWER MODULE AND ELECTRICAL DEVICE simplified abstract (BYD COMPANY LIMITED)
- 18610141. STAGGERED FLIP PIN SMT CONNECTOR TO REDUCE CROSSTALK ON HIGH-SPEED CHANNELS simplified abstract (Intel Corporation)
- 18614822. DISPLAY DEVICE simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18618181. ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18621775. DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18622813. DUAL IN-LINE MEMORY MODULE RETAINER simplified abstract (Intel Corporation)
- 18637095. PRESS APPARATUS AND PRESSING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18638231. Battery Connector simplified abstract (Google LLC)
- 18641420. FLEXIBLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (BOE Technology Group Co., Ltd.)
- 18660945. CIRCUIT BOARD REINFORCING STRUCTURE, PHOTOSENSITIVE APPARATUS, AND TERMINAL simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18666570. ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTING VOLUME OF COMPONENT simplified abstract (Samsung Electronics Co., Ltd.)
- 18676546. POWER SUPPLY UNIT FOR AEROSOL INHALER simplified abstract (Japan Tobacco Inc.)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18731522. PACKAGING STRUCTURE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18732247. BATTERY SYSTEM WITH A FLEXIBLE PRINTED CIRCUIT simplified abstract (Samsung SDI Co., Ltd.)
2
- 20240018019. HEAT DISSIPATION APPARATUS AND METHODS FOR UV-LED PHOTOREACTORS simplified abstract (THE UNIVERSITY OF BRITISH COLUMBIA)
- 20240018295. THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD simplified abstract (TAIYO INK MFG. CO., LTD.)
- 20240022008. INTEGRATED ANTENNA MODULE simplified abstract (QUALCOMM Incorporated)
- 20240032186. STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, AND COMPOSITION simplified abstract (FUJIFILM Corporation)
- 20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 20240049401. SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING simplified abstract (TRIPOD (WUXI) ELECTRONIC CO., LTD.)
- 20240055178. BLOCK COIL simplified abstract (Murata Manufacturing Co., Ltd.)
A
- Apple inc. (20240105639). COMPRESSION STRUCTURES FOR IC PACKAGES simplified abstract
- Apple inc. (20240184335). Electronic Device With Flexible Display Structures simplified abstract
- Apple Inc. patent applications on January 25th, 2024
- Apple Inc. patent applications on June 6th, 2024
- Apple Inc. patent applications on March 28th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Boe technology group co., ltd. (20240213591). FLEXIBLE BATTERY, CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract
- Boe technology group co., ltd. (20240224418). CURVED SCREEN BENDING DEVICE AND CURVED SCREEN BENDING METHOD simplified abstract
- Boe technology group co., ltd. (20240244747). WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Boe technology group co., ltd. (20240260185). CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BACKPLATE,BACKLIGHT MODULE AND DISPLAY APPARATUS simplified abstract
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on August 1st, 2024
- BOE Technology Group Co., Ltd. patent applications on July 18th, 2024
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on July 4th, 2024
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on June 27th, 2024
C
- Canon kabushiki kaisha (20240192630). IMAGE FORMING APPARATUS AND CIRCUIT BOARD FOR IMAGE FORMING APPARATUS simplified abstract
- Canon kabushiki kaisha (20240260167). ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT simplified abstract
- CANON KABUSHIKI KAISHA patent applications on August 1st, 2024
- CANON KABUSHIKI KAISHA patent applications on January 25th, 2024
- CANON KABUSHIKI KAISHA patent applications on June 13th, 2024
- Chengdu boe optoelectronics technology co., ltd. (20240213181). DISPLAY PANEL AND DISPLAY DEVICE simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240244751). DISPLAY APPARATUS simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240260216). FOLDABLE DISPLAY DEVICE simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240268029). FLEXIBLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240284648). DISPLAY MODULE AND DISPLAY DEVICE simplified abstract
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on August 1st, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. patent applications on August 22nd, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on August 8th, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on July 18th, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on June 27th, 2024
- CILAG GMBH INTERNATIONAL (20240307130). METHOD OF CLOUD BASED DATA ANALYTICS FOR USE WITH THE HUB simplified abstract
- Cloud Computing patent applications on September 19th, 2024
D
- Dell products l.p. (20240268016). FASTENING SYSTEM FOR COUPLING A COMPUTING MODULE TO A PRINTED CIRCUIT BOARD simplified abstract
- Dell products l.p. (20240284587). ROUGHNESS EDGE OF A HEAT SINK simplified abstract
- Dell products l.p. (20240292542). INFORMATION HANDLING SYSTEMS WITH A FLEXIBLE PRINTED CIRCUIT TENSIONING SYSTEM AND METHODS OF MAKING THE SAME simplified abstract
- Dell Products L.P. patent applications on August 22nd, 2024
- Dell Products L.P. patent applications on August 29th, 2024