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Category:Chung-Yi Yu of Hsin-Chu (TW)
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Pages in category "Chung-Yi Yu of Hsin-Chu (TW)"
The following 16 pages are in this category, out of 16 total.
1
- 18166196. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18298064. SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18308036. COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18437321. DIFFUSION BARRIER LAYER FOR SOURCE AND DRAIN STRUCTURES TO INCREASE TRANSISTOR PERFORMANCE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18512092. 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513942. ROUGH BUFFER LAYER FOR GROUP III-V DEVICES ON SILICON simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
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- Taiwan semiconductor manufacturing co., ltd. (20240162051). COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186258). PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243174). DIFFUSION BARRIER LAYER FOR SOURCE AND DRAIN STRUCTURES TO INCREASE TRANSISTOR PERFORMANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240292757). PIEZOELECTRIC DEVICE WITH HYDROGEN GETTER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339422). SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379570). SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379724). CAPPING STRUCTURE TO REDUCE DARK CURRENT IN IMAGE SENSORS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240381793). OXYGEN AFFINITY LAYER TO IMPROVE RRAM CELL PERFORMANCE simplified abstract
