Canon kabushiki kaisha (20240174879). CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR RECORDING CONDUCTIVE IMAGE, AND CONDUCTIVE IMAGE simplified abstract
Contents
- 1 CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR RECORDING CONDUCTIVE IMAGE, AND CONDUCTIVE IMAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR RECORDING CONDUCTIVE IMAGE, AND CONDUCTIVE IMAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR RECORDING CONDUCTIVE IMAGE, AND CONDUCTIVE IMAGE
Organization Name
Inventor(s)
MASANORI Seki of Kanagawa (JP)
YUMA Kobayashi of Kanagawa (JP)
HIROSHI Tanabe of Kanagawa (JP)
CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR RECORDING CONDUCTIVE IMAGE, AND CONDUCTIVE IMAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240174879 titled 'CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR RECORDING CONDUCTIVE IMAGE, AND CONDUCTIVE IMAGE
Simplified Explanation
The conductive composition described in the patent application includes a metal particle and a treatment agent for coating the metal particle. The treatment agent is selected from various compounds represented by different general formulas. The method of producing the conductive composition involves reducing a metal salt in an aqueous medium to form the metal particle and then bringing the formed metal particle into contact with the treatment agent.
- Metal particle
- Treatment agent for coating the metal particle
- Reduction of metal salt in an aqueous medium
- Contact with treatment agent
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, automotive, aerospace, and medical devices where conductive materials are required.
Problems Solved
This technology solves the problem of creating a conductive composition with improved properties and performance by using specific treatment agents to coat metal particles.
Benefits
The benefits of this technology include enhanced conductivity, better adhesion, and increased durability of the conductive composition, leading to more reliable and efficient products.
Potential Commercial Applications
The conductive composition developed through this technology could be used in manufacturing electronic components, sensors, circuit boards, and other devices that require reliable conductivity.
Possible Prior Art
Prior art in the field of conductive compositions may include similar methods of coating metal particles with treatment agents, but the specific compounds and formulas used in this patent application could be novel and innovative.
Unanswered Questions
How does this technology compare to existing conductive compositions in terms of cost-effectiveness and performance?
This article does not provide a direct comparison with existing conductive compositions in terms of cost-effectiveness and performance. Further research and testing would be needed to evaluate the competitiveness of this technology in the market.
What are the potential environmental impacts of using the treatment agents described in the patent application?
The environmental impacts of using the treatment agents in the conductive composition are not addressed in this article. Additional studies would be required to assess the sustainability and eco-friendliness of this technology.
Original Abstract Submitted
the conductive composition includes: a metal particle; and a treatment agent for coating the metal particle. the treatment agent is at least one kind selected from the group consisting of: a compound represented by the general formula (1); a compound represented by the general formula (2); a compound represented by the general formula (3); a compound represented by the general formula (4); a compound represented by the general formula (5); a compound represented by the general formula (6); and a compound represented by the general formula (7). the method of producing the conductive composition includes: a first step of reducing a metal salt in an aqueous medium to form the metal particle; and a second step of bringing the formed metal particle into contact with the treatment agent.
