Apple inc. (20240278533). Adhesive Structures for Electronic Devices simplified abstract

From WikiPatents
Jump to navigation Jump to search

Adhesive Structures for Electronic Devices

Organization Name

apple inc.

Inventor(s)

Xiaowei Wu of San Jose CA (US)

Farzad Khademolhosseini of Santa Clara CA (US)

Digvijay Raorane of Fremont CA (US)

Chyi-Huey J Yeh of Cupertino CA (US)

Yuxi Zhao of Sunnyvale CA (US)

Terry C Lam of Mountain View CA (US)

Bhadrinarayana Lalgudi Visweswaran of Santa Clara CA (US)

Supriya Goyal of San Jose CA (US)

Yasmin F Afsar of San Jose CA (US)

Paul S Drzaic of Morgan Hill CA (US)

Wei Lv of San Jose CA (US)

Wenyong Zhu of Saratoga CA (US)

Sijun Niu of Santa Clara CA (US)

Masoud Ghorbani Moghaddam of Santa Clara CA (US)

Adhesive Structures for Electronic Devices - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240278533 titled 'Adhesive Structures for Electronic Devices

    • Simplified Explanation:**

The patent application discusses the use of multilayer adhesive stacks in devices with flexible displays to improve performance and durability.

    • Key Features and Innovation:**
  • Multilayer adhesive stacks provide more degrees of freedom for tuning and optimizing adhesive properties.
  • Including multiple layers of adhesive improves the overall performance compared to using a single layer.
  • The adhesive stack may include soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass layers for mechanical and optical optimization.
  • Soft adhesive layers help with lateral decoupling during folding and unfolding, while harder layers provide rigidity and prevent denting during impact events.
    • Potential Applications:**

This technology can be applied in electronic devices with flexible displays, such as smartphones, tablets, and wearable devices.

    • Problems Solved:**

The technology addresses the need for improved performance and durability in devices with flexible displays by optimizing the adhesive properties.

    • Benefits:**
  • Enhanced performance and durability of devices with flexible displays.
  • Improved mechanical and optical properties of the adhesive stack.
  • Better resistance to impact events and folding/unfolding actions.
    • Commercial Applications:**

This technology can be utilized in the consumer electronics industry for the development of more robust and reliable devices with flexible displays.

    • Questions about Multilayer Adhesive Stacks:**

1. How do multilayer adhesive stacks improve the performance of devices with flexible displays?

  - Multilayer adhesive stacks provide more flexibility in tuning and optimizing adhesive properties, leading to enhanced overall performance.

2. What are the key components included in a multilayer adhesive stack for devices with flexible displays?

  - Components such as soft adhesive, hard adhesive, hard elastomer, hard polymer, and glass layers are used to optimize mechanical and optical properties.


Original Abstract Submitted

in devices with flexible displays, multilayer adhesive stacks may be included. a multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. including multiple layers of adhesive in the adhesive stack (as opposed to a single layer) provides more degrees of freedom for the tuning and optimization of the properties of the adhesive stack. the multilayer adhesive stack therefore has better performance than if only a single layer of adhesive is used. the multilayer adhesive stack may include one or more layers of soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass to optimize the mechanical and optical performance of the multilayer adhesive stack. soft adhesive layers may be included to optimize lateral decoupling (e.g., during folding and unfolding) of the adhesive stack. harder layers may be included to provide rigidity and prevent denting during impact events.