View source for 20250221310. Adaptive Liquid Cooling System Chip Pack (Taiwan Semiconductor Manufacturing , .)

= ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE =

'''Abstract''':
a liquid cooling system includes a thermoelectric cooler (tec) between a radiator plate and a radiator, and a thermoelectric generator (teg) at a location where the teg is driven by heat from a chip package. the chip package is cooled by a cold plate of the liquid cooling system and the tec is controlled by the teg. the teg may be between the chip package and the cold plate or elsewhere in or adjacent to the chip package. the teg may control the tec through a relay. the teg automatically activates the tec when the chip package is under peak load.

'''Inventor(s)''': [[:Category:Chien-Chang Wang of Hsinchu City  TW|Chien-Chang Wang]], [[:Category:Kuan-Min Wang of Hsinchu City  TW|Kuan-Min Wang]], [[:Category:Ching Wang of Taichung City  TW|Ching Wang]], [[:Category:Kuo-Chin Chang of Chiayi City  TW|Kuo-Chin Chang]], [[:Category:Kathy Wei Yan of Hsinchu  TW|Kathy Wei Yan]], [[:Category:Jun He of Zhubei City  TW|Jun He]]

'''CPC Classification''': [[:Category:CPC_H10N10/13|H10N10/13]] (characterised by the heat-exchanging means at the junction)


[[Category:Patent Applications]]
[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]
[[Category:CPC_H10N10/13]]
[[Category:Chien-Chang Wang of Hsinchu City  TW]]
[[Category:Kuan-Min Wang of Hsinchu City  TW]]
[[Category:Ching Wang of Taichung City  TW]]
[[Category:Kuo-Chin Chang of Chiayi City  TW]]
[[Category:Kathy Wei Yan of Hsinchu  TW]]
[[Category:Jun He of Zhubei City  TW]]

[https://wikipatents.org/index.php?search=20250221310+rejection&title=Special%3ASearch&wprov=acrw1_-1 Search for rejections for patent application number 20250221310]


<!-- JSON-LD markup for search engines:
{"@context":"https://schema.org","@type":"TechArticle","headline":"20250221310. Adaptive Liquid Cooling System Chip Pack (Taiwan Semiconductor Manufacturing , .)","name":"20250221310. Adaptive Liquid Cooling System Chip Pack (Taiwan Semiconductor Manufacturing , .)","description":"Patent application abstract and classification for 20250221310 - Adaptive Liquid Cooling System For Chip Pack","datePublished":"2025-07-03","mainEntity":{"@type":"GovernmentPermit","permitType":"Patent Application","identifier":"20250221310","name":"Adaptive Liquid Cooling System For Chip Pack","additionalProperty":[{"@type":"PropertyValue","name":"Organization","value":"Taiwan Semiconductor Manufacturing Company, Ltd."}]}}
-->