18640791. Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
Electronic Device
Organization Name
Inventor(s)
Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18640791 titled 'Electronic Device
The abstract describes an electronic device with a fan, a housing, a heat dissipation assembly, and a heat emitting component all enclosed within the housing. The fan is connected to the housing through side plates and together with the heat dissipation assembly, they create an air outlet channel that connects to the fan's air outlet and the housing's air exhaust vent.
- The electronic device includes a fan, housing, heat dissipation assembly, and heat emitting component.
- The fan is connected to the housing through side plates.
- The fan, housing, side plates, and heat dissipation assembly create an air outlet channel.
- The air outlet channel connects to the fan's air outlet and the housing's air exhaust vent.
Potential Applications: - Cooling electronic devices such as computers, servers, or gaming consoles. - Improving airflow and heat dissipation in small spaces. - Enhancing the performance and longevity of electronic components.
Problems Solved: - Overheating issues in electronic devices. - Inadequate cooling systems in compact devices. - Ensuring proper ventilation for efficient operation.
Benefits: - Increased efficiency and performance of electronic devices. - Prevention of overheating and potential damage to components. - Extended lifespan of electronic devices.
Commercial Applications: Title: Enhanced Cooling System for Electronic Devices This technology can be used in the manufacturing of computers, servers, and other electronic devices to improve their cooling systems, leading to better performance and reliability. The market implications include increased demand for high-performance electronic devices with efficient cooling solutions.
Prior Art: Readers can explore prior art related to cooling systems for electronic devices by researching patents in the field of thermal management, heat dissipation, and fan technology.
Frequently Updated Research: Researchers are constantly studying ways to enhance cooling systems for electronic devices, including advancements in fan design, heat dissipation materials, and overall system efficiency.
Questions about Enhanced Cooling System for Electronic Devices: 1. How does this technology compare to traditional cooling methods used in electronic devices? This technology offers a more efficient and effective cooling solution compared to traditional methods, ensuring better performance and longevity of electronic devices.
2. What are the potential cost implications of implementing this enhanced cooling system in electronic devices? The cost implications may vary depending on the scale of production and the specific components used, but the long-term benefits of improved performance and reliability can outweigh the initial investment.
Original Abstract Submitted
An electronic device includes a fan, a housing, a heat dissipation assembly, and a heat emitting component. The fan, the heat dissipation assembly, and the heat emitting component are disposed in the housing. The fan includes a first side plate and a second side plate. The fan is coupled to the housing through the first side plate and the second side plate. The first side plate, the second side plate, the housing, and the heat dissipation assembly enclose an air outlet channel, and the air outlet channel couples with an air outlet of the fan and an air exhaust vent of the housing.
