18616989. SOCKET DESIGN FOR A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)

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SOCKET DESIGN FOR A MEMORY DEVICE

Organization Name

Micron Technology, Inc.

Inventor(s)

Amitava Majumdar of Boise ID (US)

Radhakrishna Kotti of Boise ID (US)

Rajasekhar Venigalla of Boise ID (US)

SOCKET DESIGN FOR A MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18616989 titled 'SOCKET DESIGN FOR A MEMORY DEVICE

The patent application describes methods, systems, and devices supporting a socket design for a memory device.

  • Memory arrays within a die may have various word lines and bit lines intersecting at memory cell locations.
  • Sockets couple word lines and bit lines to drivers, with sockets strategically placed for efficient connection.
  • Memory cells farther from a word line socket are closer to a bit line socket, optimizing data transfer.
  • Sockets may be arranged in parallel rows or regions, enhancing the overall design efficiency.
    • Potential Applications:**

This technology can be applied in the development of high-performance memory devices for various electronic applications.

    • Problems Solved:**

Efficiently connecting word lines and bit lines in memory devices to improve data transfer speed and overall performance.

    • Benefits:**

Enhanced data transfer efficiency, improved memory device performance, and optimized design for better functionality.

    • Commercial Applications:**

Optimized memory devices using this technology can be utilized in smartphones, computers, servers, and other electronic devices requiring high-speed data processing.

    • Questions about Memory Device Socket Design:**

1. How does the placement of sockets impact the efficiency of data transfer in memory devices? 2. What are the key advantages of having word lines and bit lines oriented in different directions in memory devices?


Original Abstract Submitted

Methods, systems, and devices supporting a socket design for a memory device are described. A die may include one or more memory arrays, which each may include any number of word lines and any number of bit lines. The word lines and the bit lines may be oriented in different directions, and memory cells may be located at the intersections of word lines and bit lines. Sockets may couple the word lines and bit lines to associated drivers, and the sockets may be located such that memory cells farther from a corresponding word line socket are nearer a corresponding bit line socket, and vice versa. For example, sockets may be disposed in rows or regions that are parallel to one another, and which may be non-orthogonal to the corresponding word lines and bit lines.