18564396. CIRCUIT ASSEMBLY simplified abstract (SUMITOMO WIRING SYSTEMS, LTD.)
Contents
CIRCUIT ASSEMBLY
Organization Name
Inventor(s)
CIRCUIT ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18564396 titled 'CIRCUIT ASSEMBLY
Simplified Explanation:
The patent application describes a circuit assembly that includes a relay housed in a case, along with a bus bar for heat dissipation. The relay has an excitation connector part on its side surface, and the bus bar is fastened to a connection part of the relay while being in thermal contact with an external heat dissipation target.
- The circuit assembly includes a relay, a case, and a bus bar for heat dissipation.
- The relay has an excitation connector part on its side surface.
- The bus bar is fastened to a connection part of the relay and is in thermal contact with an external heat dissipation target.
- The bus bar protrudes upward from the heat transfer part at an angle larger than 90°.
- The excitation connector part of the relay is open obliquely upward.
Potential Applications: This technology could be used in various electrical systems and devices where efficient heat dissipation is required, such as automotive electronics, industrial control systems, and power distribution units.
Problems Solved: This technology addresses the issue of heat buildup in relay systems, which can lead to malfunctions and reduced lifespan of the components. By providing a reliable heat dissipation solution, the circuit assembly ensures optimal performance and longevity of the relay.
Benefits: - Improved reliability and performance of relay systems - Extended lifespan of components - Enhanced thermal management for efficient operation
Commercial Applications: Title: Advanced Heat Dissipation Circuit Assembly for Enhanced Relay Performance This technology can be commercialized in industries such as automotive, manufacturing, and telecommunications for applications requiring reliable relay systems with efficient heat dissipation capabilities. The market implications include increased product reliability, reduced maintenance costs, and improved overall system performance.
Prior Art: Prior art related to this technology may include patents or research papers on heat dissipation solutions for electronic components, relay systems, and thermal management in electrical devices.
Frequently Updated Research: Researchers are continually exploring new materials and designs for improved heat dissipation in electronic components, which could lead to advancements in relay technology and thermal management systems.
Questions about Circuit Assembly Technology: 1. How does the bus bar in this circuit assembly improve heat dissipation compared to traditional methods? 2. What are the specific industries that could benefit the most from this advanced heat dissipation technology?
Original Abstract Submitted
A circuit assembly includes: a relay; a case that houses the relay; and a bus bar including a fastening part configured to be fastened to a connection part of the relay, and a heat transfer part configured to be in thermally conductive contact with an external heat dissipation target, wherein the relay includes an excitation connector part that is provided on a side surface of the relay, and that is open in a direction opposite to a direction in which the connection part is open, the fastening part of the bus bar protrudes upward from the heat transfer part disposed on a bottom wall side of the case so as to be inclined at an angle larger than 90°, and the excitation connector part of the relay in which the connection part connected to the fastening part of the bus bar is open obliquely upward.
