18432451. LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
Contents
- 1 LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER
Organization Name
Inventor(s)
Toshio Shiobara of Annaka-shi (JP)
Hajime Itokawa of Annaka-shi (JP)
LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18432451 titled 'LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER
Simplified Explanation
The method for manufacturing a low dielectric silica powder involves heat-treating silica powder at a high temperature to achieve a very low dielectric loss tangent, followed by etching the surface of the heat-treated powder with an etching solution.
- Silica powder is heat-treated at a temperature between 500°C to 1500°C to achieve a dielectric loss tangent of 0.0005 or less at 10 GHz.
- The heat-treated silica powder is then etched with an etching solution to further enhance its properties.
- The resulting silica powder has an extremely small dielectric loss tangent and strong adhesion at the interface to resin.
Potential Applications
The low dielectric silica powder can be used in various applications such as:
- Electronic components
- High-frequency communication devices
- Insulating materials
Problems Solved
This technology addresses the following issues:
- High dielectric loss in silica powders
- Poor adhesion at the interface to resin materials
Benefits
The benefits of this technology include:
- Improved performance in high-frequency applications
- Enhanced adhesion to resin materials
- Increased efficiency in electronic components
Potential Commercial Applications
This technology can be applied in industries such as:
- Electronics manufacturing
- Telecommunications
- Aerospace
Possible Prior Art
Prior art may include methods for improving the dielectric properties of silica powders, but the specific combination of heat treatment and etching for achieving low dielectric loss tangent and strong adhesion may be novel.
Unanswered Questions
How does this technology compare to existing methods for improving dielectric properties of silica powders?
This article does not provide a direct comparison with existing methods, leaving uncertainty about the specific advantages of this approach over others.
What are the long-term effects of the etching solution on the properties of the silica powder?
The article does not address the potential long-term effects of the etching solution on the properties of the silica powder, raising questions about the stability and durability of the material over time.
Original Abstract Submitted
A method for manufacturing a low dielectric silica powder incudes heat-treating a silica powder at a temperature of 500° C. to 1500° C. to achieve 0.0005 or less of a dielectric loss tangent of the silica powder at 10 GHz, and etching a surface of the heat-treated silica powder with an etching solution. A silica powder with an extremely small dielectric loss tangent, a resin composition containing the same, and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin are achieved.
