18396873. LIQUID EJECTION DEVICE simplified abstract (CANON KABUSHIKI KAISHA)

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LIQUID EJECTION DEVICE

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

YUZURU Ishida of Kanagawa (JP)

SHINYA Iwahashi of Kanagawa (JP)

YOSHINORI Misumi of Tokyo (JP)

KOICHI Ishida of Tokyo (JP)

LIQUID EJECTION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18396873 titled 'LIQUID EJECTION DEVICE

Simplified Explanation:

This patent application describes a liquid ejection device that includes an element substrate with an ejection port and a voltage application unit that applies a voltage to the element substrate. The device has multiple layers and channels for liquid ejection, along with electrodes for controlling the voltage applied.

  • The device has an element substrate with an ejection port and channels for liquid flow.
  • Electrodes are used to control the voltage applied to the device.
  • The device is designed for efficient liquid ejection.

Key Features and Innovation:

  • Element substrate with ejection port and channels
  • Electrodes for voltage control
  • Efficient liquid ejection mechanism

Potential Applications:

This technology could be used in inkjet printers, 3D printing, and other applications that require precise liquid ejection.

Problems Solved:

This technology addresses the need for accurate and controlled liquid ejection in various industries.

Benefits:

  • Precise liquid ejection
  • Improved printing quality
  • Enhanced efficiency in liquid handling processes

Commercial Applications:

The technology could be applied in the manufacturing industry for printing, prototyping, and other liquid handling processes.

Questions about Liquid Ejection Devices:

1. How does the voltage application unit control the liquid ejection process? 2. What are the potential limitations of this technology in terms of liquid viscosity and volume control?


Original Abstract Submitted

A liquid ejection device has an element substrate having an ejection port; and a voltage application unit applying a voltage to the element substrate, wherein the element substrate has a first layer having the ejection port and a first channel communicating with the ejection port and a second layer fixed to a back face of the first layer and having a second channel communicating with the first channel, a heat element for ejecting the liquid, a first electrode covering a surface of the heat element on a side of the first layer and exposed to the first channel, and a second electrode exposed to the first channel at a position different from the first electrode and not overlapping the heat element on a plan view, and the voltage application unit is configured to apply the voltage so that the first electrode is at a negative potential.