18395973. SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
Organization Name
Inventor(s)
Chung Woo Lee of Suwon-si (KR)
Ji Won Cha of Hwaseong-si (KR)
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18395973 titled 'SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
The substrate treating apparatus described in the patent application is designed to accurately determine the center coordinate values of a substrate and a support unit, and then record and convert these values to teach a transfer robot.
- The analysis part communicates with a measurement unit to input information about a boundary.
- It calculates the center coordinate values of the substrate and support unit based on the boundary information.
- The calculated center coordinate value of the support unit is set as the center coordinate value of the measurement unit.
- The calculated center coordinate value of the substrate is set as the center coordinate value of the transfer robot.
- The center coordinate value of the transfer robot is recorded on the plane coordinate system of the measurement unit.
- The recorded values are then converted to the plane coordinate system of the transfer robot to teach it.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Precision engineering
Problems Solved: - Ensures accurate positioning of substrates and support units - Facilitates efficient teaching of transfer robots
Benefits: - Improved accuracy in substrate handling - Enhanced efficiency in robotic operations - Reduced errors in manufacturing processes
Commercial Applications: Title: Precision Substrate Handling System for Semiconductor Manufacturing This technology can be used in semiconductor manufacturing facilities to streamline production processes and improve overall efficiency. It can also be applied in electronics assembly plants to enhance precision and reduce errors in handling delicate components.
Questions about the technology: 1. How does this substrate treating apparatus improve the efficiency of manufacturing processes? - This technology streamlines the handling of substrates and support units, reducing errors and improving overall accuracy in manufacturing operations. 2. What are the potential cost savings associated with implementing this system in a manufacturing facility? - By increasing efficiency and reducing errors, this technology can lead to cost savings in terms of reduced waste and improved productivity.
Original Abstract Submitted
The substrate treating apparatus includes an analysis part configured to communicate with a measurement unit to be input with an information with respect to a boundary, to calculate a center coordinate value of a substrate and a center coordinate value of a support unit with an input information on the boundary, to set a calculated center coordinate value of the support unit as a center coordinate value of the measurement unit, to set a calculated center coordinate value of the substrate as a center coordinate value of a transfer robot, to record the center coordinate value of the transfer robot on a plane coordinate system of the measurement unit, and to convert a recorded center coordinate value of the transfer robot and a center coordinate value of the measurement unit to a plane coordinate system of the transfer robot to teach the transfer robot.
