18389964. SEMICONDUCTOR DEVICE AND APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
SEMICONDUCTOR DEVICE AND APPARATUS
Organization Name
Inventor(s)
TOMOTAKE Morita of Kanagawa (JP)
SEMICONDUCTOR DEVICE AND APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18389964 titled 'SEMICONDUCTOR DEVICE AND APPARATUS
The semiconductor device described in the abstract includes a semiconductor layer with first and second surfaces, a wiring structure on the second surface, and a pad exposed through an opening in the first surface. The pad is located between the first surface and the closest wiring layer in the structure, partially exposed by the opening.
- The pad has a third surface and is surrounded by an insulating portion embedded in the semiconductor layer.
- The insulating portion's outer edge surrounds the pad's outer edge, and the opening's wall surface is formed by the semiconductor layer and insulating portion.
- The opening's wall surface may also be formed solely by the insulating portion.
Potential Applications: - Integrated circuits - Semiconductor manufacturing - Electronics industry
Problems Solved: - Improved integration of wiring structures in semiconductor devices - Enhanced insulation and protection of wiring layers
Benefits: - Increased efficiency in semiconductor device performance - Enhanced durability and reliability - Simplified manufacturing processes
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to improved functionality and reliability. The market implications include increased demand for advanced semiconductor components in various industries.
Prior Art: Readers can explore prior patents related to semiconductor device manufacturing processes, wiring structures, and insulation techniques to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further enhance the performance and efficiency of semiconductor devices. Stay updated on the latest advancements in the industry to remain at the forefront of innovation.
Questions about Semiconductor Devices: 1. What are the key challenges in integrating wiring structures in semiconductor devices?
- The integration of wiring structures in semiconductor devices can be challenging due to the need for precise alignment and insulation to ensure optimal performance.
2. How does the insulating portion embedded in the semiconductor layer contribute to the device's functionality?
- The insulating portion provides enhanced protection and insulation for the wiring layers, improving the overall durability and reliability of the semiconductor device.
Original Abstract Submitted
A semiconductor device is provided. The device includes a semiconductor layer which forms a part of first and second surfaces respectively, a wiring structure arranged on the second surface, and a pad. An opening portion for exposing the pad is provided in the first surface. The pad is arranged between the first surface and a wiring layer closest to the second surface among wiring layers arranged in the wiring structure, and has a third surface which partially exposed by the opening portion. An insulating portion forming a part of the second surface is embedded in the semiconductor layer. An outer edge of the insulating portion is arranged so as to surround an outer edge of the pad. A wall surface of the opening portion is formed by the semiconductor layer and the insulating portion, or formed by the insulating portion.
