18384156. ELECTRONIC DEVICE INCLUDING ANTENNA simplified abstract (Samsung Electronics Co., Ltd.)
Contents
ELECTRONIC DEVICE INCLUDING ANTENNA
Organization Name
Inventor(s)
Kwanghyun Baek of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING ANTENNA - A simplified explanation of the abstract
This abstract first appeared for US patent application 18384156 titled 'ELECTRONIC DEVICE INCLUDING ANTENNA
The abstract describes a radio unit (RU) module that includes a first substrate with a radio frequency integrated circuit (RFIC), a second substrate with multiple layers including antenna elements and conductivity members.
- The RU module consists of a first substrate with an RFIC and a second substrate with multiple layers.
- The second substrate contains antenna elements and conductivity members.
- The RFIC is connected to the first surface of the first substrate.
- The antenna elements are located on the first layer of the second substrate.
- The conductivity members are spread across the multiple layers of the second substrate.
Potential Applications: - Wireless communication devices - IoT devices - Satellite communication systems
Problems Solved: - Efficient radio frequency signal transmission - Compact design for electronic devices
Benefits: - Improved signal reception and transmission - Space-saving design for compact devices
Commercial Applications: Title: "Innovative Radio Unit Module for Enhanced Wireless Communication" This technology can be used in smartphones, smartwatches, and other wireless devices to improve signal strength and connectivity. It can also be applied in satellite communication systems for enhanced data transmission.
Prior Art: Research on similar RFIC and antenna integration technologies in the field of wireless communication devices can provide insights into the development of this RU module.
Frequently Updated Research: Ongoing studies on RFIC design and antenna integration techniques can contribute to the advancement of this technology.
Questions about Radio Unit Module: 1. How does the integration of RFIC and antenna elements improve wireless communication devices? 2. What are the potential challenges in implementing this RU module in IoT devices?
Original Abstract Submitted
A radio unit (RU) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (RFIC); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. The RFIC may be coupled to the first surface of the first substrate. The second substrate may be coupled to the second surface of the first substrate. The plurality of antenna elements may be disposed on the at least one first layer of the second substrate. The plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
