18380361. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380361 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first substrate with solder balls on the lower surface and a first semiconductor chip on the upper surface. The arrangement of the solder balls is specified in terms of direction and distance from the center of the substrate.
- The solder balls are strategically placed on the first substrate, with specific distances and directions from the center.
- The pitch between the balls varies depending on their position relative to each other.
- This design optimizes the layout of the solder balls for efficient connectivity and performance of the semiconductor package.
Potential Applications: - This technology can be used in various electronic devices that require semiconductor packages. - It can improve the reliability and performance of integrated circuits in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - The technology addresses the challenge of optimizing the layout of solder balls for effective connectivity in semiconductor packages. - It ensures a reliable and efficient connection between the semiconductor chip and the external components.
Benefits: - Enhanced connectivity and performance of semiconductor packages. - Improved reliability and durability of electronic devices. - Cost-effective manufacturing process for semiconductor packages.
Commercial Applications: Title: Enhanced Semiconductor Package Design for Improved Connectivity This technology can be utilized in the production of various electronic devices, leading to improved performance and reliability. The market implications include increased demand for high-quality semiconductor packages in the electronics industry.
Questions about the technology: 1. How does the specific arrangement of solder balls contribute to the overall performance of the semiconductor package? - The arrangement of solder balls optimizes connectivity and ensures efficient operation of the semiconductor package. 2. What are the potential cost savings associated with using this technology in electronic device manufacturing? - The optimized layout of solder balls can lead to cost-effective production processes and improved product reliability.
Original Abstract Submitted
A semiconductor package includes a first substrate. Solder balls are disposed on a lower surface of the first substrate. A first semiconductor chip is on an upper surface of the first substrate. The solder balls include a first ball disposed in a first direction from a center of the first substrate and spaced apart from the center by a first distance. A second ball is disposed in a third direction from the center between the first and second directions and is spaced apart from the center by a second distance less than or equal to the first distance. A first pitch between the first ball and a first adjacent ball disposed immediately to an outer side in the first direction is less than a second pitch between the first ball and a second adjacent ball disposed immediately adjacent to an inner side in the first direction.
