18281910. DEVICE MODULE simplified abstract (SUMITOMO WIRING SYSTEMS, LTD.)
Contents
DEVICE MODULE
Organization Name
Inventor(s)
Yasuyuki Yamamoto of Osaka (JP)
Takuya Taniguchi of Osaka (JP)
DEVICE MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18281910 titled 'DEVICE MODULE
The patent application aims to provide a technique for cooling a device without the need for it to be housed inside a duct.
- A device module includes a support member located in a vehicle's roof inner space between a roof panel and an interior member.
- The device is supported by a support surface on the support member, creating a support-member-side flow path inside the support member.
- The support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.
Potential Applications: - Automotive industry for cooling electronic devices in vehicles - Aerospace industry for cooling equipment in aircraft - Industrial applications for cooling machinery in tight spaces
Problems Solved: - Eliminates the need for bulky ducts to cool devices - Provides a more efficient cooling solution in confined spaces
Benefits: - Space-saving design - Improved cooling efficiency - Simplified installation process
Commercial Applications: Cooling systems for vehicles, aircraft, industrial machinery
Questions about the technology: 1. How does this cooling technique compare to traditional duct-based systems? 2. What are the potential cost savings associated with implementing this technology?
Frequently Updated Research: Research on advanced cooling techniques in the automotive and aerospace industries.
Original Abstract Submitted
One aim is to provide a technique allowing a device to be cooled without being housed inside a duct. A device module includes: a support member that is disposed in a roof inner space that is located between a roof panel and an interior member in a vehicle; and a device that is supported by a support surface among outer surfaces of the support member. A support-member-side flow path is formed inside the support member, and the support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.
