18239846. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR PACKAGE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

JOONGHYUN Baek of Suwon-si (KR)

HYUNSOO Chung of Suwon-si (KR)

SEOK-HONG Kwon of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18239846 titled 'SEMICONDUCTOR PACKAGE

The semiconductor package described in the patent application consists of a first redistribution layer, a first semiconductor chip, and a second semiconductor chip. The first redistribution layer comprises a first intervening interconnection layer and a first upper interconnection layer.

  • The first intervening interconnection layer includes a first intervening insulating layer, a first intervening redistribution pattern, and a stress buffer pattern that is electrically floated and spaced apart from the first intervening redistribution pattern.
  • The first upper interconnection layer consists of a first upper insulating layer, a first upper redistribution pattern, and a first test pad located on the first upper redistribution pattern.
  • The stress buffer pattern has a larger area compared to the first test pad.

Key Features and Innovation:

  • Incorporation of a stress buffer pattern in the first redistribution layer to mitigate mechanical stress on the semiconductor chips.
  • Electrically floating the stress buffer pattern to enhance its effectiveness in reducing stress.
  • Placement of a test pad on the first upper redistribution pattern for testing purposes.

Potential Applications:

  • Advanced semiconductor packaging for electronic devices.
  • High-performance computing systems.
  • Aerospace and defense applications requiring reliable semiconductor packaging.

Problems Solved:

  • Minimizing mechanical stress on semiconductor chips.
  • Improving the reliability and longevity of semiconductor packages.
  • Facilitating testing and quality control processes.

Benefits:

  • Enhanced durability and performance of electronic devices.
  • Increased reliability of semiconductor packages.
  • Streamlined testing procedures for semiconductor chips.

Commercial Applications:

  • Semiconductor industry for manufacturing high-quality electronic devices.
  • Technology companies developing cutting-edge computing systems.
  • Aerospace and defense contractors requiring robust semiconductor packaging solutions.

Questions about Semiconductor Package Technology: 1. How does the stress buffer pattern contribute to reducing mechanical stress on the semiconductor chips? 2. What are the potential implications of electrically floating the stress buffer pattern in the semiconductor package design?

Frequently Updated Research: Ongoing research in semiconductor packaging materials and techniques to further enhance the performance and reliability of electronic devices.


Original Abstract Submitted

A semiconductor package includes a first redistribution layer, a first semiconductor chip, and a second semiconductor chip. The first redistribution layer includes a first intervening interconnection layer and a first upper interconnection layer. The first intervening interconnection layer includes a first intervening insulating layer, a first intervening redistribution pattern, and a stress buffer pattern, which is spaced apart from the first intervening redistribution pattern and is in an electrically floated state. The first upper interconnection layer includes a first upper insulating layer, a first upper redistribution pattern, and a first test pad on the first upper redistribution pattern. An area of the stress buffer pattern is larger than an area of the first test pad.

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