18231324. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Kyoung Jin Cha of Suwon-si (KR)
Hyung Jong Choi of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18231324 titled 'MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation:
The patent application describes a multilayer electronic component with specific compositions in the internal electrodes for improved performance.
- The electronic component has a body with a capacitance formation portion containing dielectric layers and internal electrodes.
- Two cover portions, each with a dielectric layer, are placed on either side of the capacitance formation portion.
- An external electrode is also present on the body.
- The internal electrodes have a specific molar ratio of Sn/(Ni+Sn) in the central portion for optimal functionality.
Key Features and Innovation:
- Multilayer electronic component design with alternating dielectric layers and internal electrodes.
- Specific composition of internal electrodes for improved performance.
- Presence of cover portions with dielectric layers for protection and insulation.
- External electrode for connectivity.
- Optimization of molar ratio of Sn/(Ni+Sn) in internal electrodes for enhanced functionality.
Potential Applications:
The technology can be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved:
- Improved performance and functionality of electronic components.
- Enhanced durability and reliability.
- Optimal composition for internal electrodes.
Benefits:
- Higher performance and efficiency.
- Increased durability and reliability.
- Enhanced functionality in electronic devices.
Commercial Applications:
Potential commercial applications include the manufacturing of electronic components for consumer electronics, telecommunications equipment, and industrial machinery.
Questions about Multilayer Electronic Component:
1. How does the specific composition of internal electrodes impact the performance of the electronic component? 2. What are the potential drawbacks of using this technology in electronic devices?
2. What are the potential drawbacks of using this technology in electronic devices?
3. How does the molar ratio of Sn/(Ni+Sn) affect the functionality of the electronic component?
4. Are there any specific industry standards or regulations related to the composition of internal electrodes in electronic components?
5. How does the presence of cover portions with dielectric layers contribute to the overall performance and durability of the electronic component?
Original Abstract Submitted
A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein a molar ratio of Sn/(Ni+Sn) measured in a central portion of an internal electrode disposed closest to the first cover portion or the second cover portion is 0.00160 or more and 0.0230 or less, and a molar ratio of Sn/(Ni+Sn) measured in a central portion of at least one internal electrode, among the plurality of internal electrodes, is 0.00066 or less.
