18224670. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Jin Hyung Lim of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18224670 titled 'MULTILAYER ELECTRONIC COMPONENT
The abstract describes a multilayer electronic component with a body containing surfaces facing each other in different directions, a capacitance forming portion with internal electrodes and a dielectric layer, lower and upper cover portions, and external electrodes.
- The electronic component has a body with multiple surfaces and a capacitance forming portion with internal electrodes and a dielectric layer.
- Lower and upper cover portions are included in the component, along with external electrodes on different surfaces.
- Only the upper cover portion contains a buffer electrode, providing a unique feature to the component.
- The design allows for efficient capacitance formation and electronic functionality within the component.
- The component is structured to optimize performance and reliability in electronic applications.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a compact and efficient solution for electronic component integration. - Enhances the performance and reliability of electronic devices. - Offers a unique design feature with the buffer electrode in the upper cover portion.
Benefits: - Improved capacitance formation and electronic functionality. - Enhanced performance and reliability in electronic applications. - Compact design for space-saving in electronic devices.
Commercial Applications: - This technology can be utilized by electronic manufacturers for various consumer electronics and industrial equipment. - It can also be integrated into automotive electronics for improved performance and functionality.
Questions about Multilayer Electronic Component: 1. How does the buffer electrode in the upper cover portion enhance the performance of the electronic component? 2. What are the specific advantages of using a multilayer design with internal electrodes and a dielectric layer in electronic components?
Original Abstract Submitted
A multilayer electronic component includes a body including first and second surfaces facing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and including a capacitance forming portion including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a lower cover portion disposed between the first surface and the capacitance forming portion, and an upper cover portion disposed between the second surface and the capacitance forming portion, a first external electrode disposed on the third surface, and a second external electrode disposed on the fourth surface, wherein, among the upper cover portion and the lower cover portion, only the upper cover portion includes a buffer electrode.
