18139444. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Hyo Sung Choi of Suwon-si (KR)
Jung Jin Park of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18139444 titled 'MULTILAYER ELECTRONIC COMPONENT
The multilayer electronic component described in the patent application consists of a body with a capacitance formation portion containing a dielectric layer and an internal electrode, along with a cover portion on both ends and an external electrode connected to the internal electrode.
- The cover portion of the component contains fluorine and dielectric grains, with the average size of the grains in the cover portion (A1) being smaller than the average size of the grains in the dielectric layer (A2).
- The internal electrode and external electrode are alternately disposed in the body in a first direction.
- The technology aims to improve the performance and efficiency of electronic components by optimizing the size and composition of the dielectric grains in the cover portion.
- By incorporating fluorine into the cover portion, the component may exhibit enhanced electrical properties and stability.
- The design of the component allows for better control of capacitance and electrical conductivity, leading to more reliable electronic devices.
Potential Applications: This technology can be applied in various electronic devices such as smartphones, tablets, computers, and other consumer electronics. It can also be used in industrial applications where high-performance electronic components are required.
Problems Solved: The technology addresses issues related to capacitance control, electrical stability, and performance optimization in electronic components. It improves the reliability and efficiency of electronic devices by enhancing the properties of the multilayer electronic component.
Benefits: Enhanced electrical properties Improved performance and efficiency of electronic devices Better control of capacitance and electrical conductivity Increased reliability of electronic components
Commercial Applications: The technology can be utilized by electronic manufacturers to enhance the performance of their products and gain a competitive edge in the market. It can also be integrated into various industrial applications to improve the efficiency and reliability of electronic systems.
Questions about Multilayer Electronic Component:
1. How does the incorporation of fluorine in the cover portion benefit the performance of the electronic component?
- The inclusion of fluorine in the cover portion enhances the electrical properties and stability of the component, leading to improved performance and reliability.
2. What specific advantages does the optimized size and composition of dielectric grains in the cover portion offer in electronic devices?
- The optimized size and composition of dielectric grains in the cover portion allow for better control of capacitance and electrical conductivity, resulting in more efficient and reliable electronic devices.
Original Abstract Submitted
A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.
