18071901. OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract (Intel Corporation)
Contents
- 1 OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
Organization Name
Inventor(s)
Minglu Liu of Chandler AZ (US)
Alexander Aguinaga of Phoenix AZ (US)
Jung Kyu Han of Chandler AZ (US)
Yosuke Kanaoka of Chandler AZ (US)
Robin Mcree of Chandler AZ (US)
Hong Seung Yeon of Chandler AZ (US)
OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071901 titled 'OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
Simplified Explanation
The package architecture described in the patent application includes a first substrate with a fiducial mark, and a second substrate made of glass with another fiducial mark that overlaps with the first one.
- The package architecture comprises a first substrate with a first fiducial mark on its surface.
- The package architecture also includes a second substrate made of glass with a second fiducial mark, overlapping with the first fiducial mark.
Potential Applications
This technology could be applied in:
- Semiconductor packaging
- Microelectronics manufacturing
Problems Solved
This technology helps in:
- Improving alignment accuracy in manufacturing processes
- Enhancing the overall quality of electronic components
Benefits
The benefits of this technology include:
- Increased precision in alignment
- Improved reliability of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor industry
- Electronics manufacturing
Possible Prior Art
One possible prior art for this technology could be the use of fiducial marks in semiconductor packaging and microelectronics manufacturing processes.
Unanswered Questions
How does this technology compare to existing alignment methods in terms of accuracy and efficiency?
This article does not provide a direct comparison with existing alignment methods.
Are there any limitations or drawbacks to using this package architecture in manufacturing processes?
This article does not address any limitations or drawbacks associated with the use of this package architecture.
Original Abstract Submitted
Embodiments disclosed herein include a package architecture. In an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. In an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.
