18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES

Organization Name

Intel Corporation

Inventor(s)

Jeremy Ecton of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18059089 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES

Simplified Explanation

The abstract describes a patent application related to microelectronic assemblies, devices, and methods involving a photonic assembly with an interposer, a photonic integrated circuit (PIC), and an optical component.

• The photonic assembly includes an interposer with glass material and through-glass vias (TGVs), a PIC optically coupled to the interposer's surface using optical glue or fusion bonding, and electrically coupled to the TGVs with hybrid bond interconnects, and an optical component optically coupled to the interposer through an optical pathway.

• The interposer serves as a platform for integrating the PIC and optical component, enabling optical and electrical connections between them.

• The use of TGVs in the interposer allows for vertical integration of optical and electrical components, reducing footprint and improving performance.

• The hybrid bond interconnects provide a reliable electrical connection between the PIC and TGVs in the interposer.

• The optical pathway through the interposer facilitates optical communication between the PIC and the optical component.

Potential Applications

This technology can be applied in telecommunications, data centers, and high-speed computing for efficient optical communication and integration of photonic components.

Problems Solved

This technology solves the challenge of integrating photonic components with different functionalities in a compact and efficient manner, enabling high-speed optical communication.

Benefits

The benefits of this technology include improved performance, reduced footprint, enhanced reliability, and simplified integration of photonic components.

Potential Commercial Applications

Potential commercial applications of this technology include optical transceivers, optical interconnects, photonic integrated circuits, and optical sensors.

Possible Prior Art

One possible prior art could be the use of traditional interposers for integrating electronic components, but not specifically designed for photonic integration.

How does this technology compare to existing methods of integrating photonic components?

This article does not provide a direct comparison with existing methods of integrating photonic components, such as flip-chip bonding or wire bonding. It would be helpful to understand the advantages and disadvantages of this technology compared to others.

What are the scalability and cost implications of implementing this technology in mass production?

The article does not address the scalability and cost implications of mass-producing microelectronic assemblies using this technology. Understanding the manufacturing feasibility and cost-effectiveness of this technology on a large scale would be crucial for its commercial success.

Original Abstract Submitted

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include an interposer having a surface, wherein a material of the interposer includes glass and the interposer includes through-glass vias (TGVs); a photonic integrated circuit (PIC) optically coupled to the surface of the interposer by optical glue or fusion bonding and electrically coupled to the TGVs in the interposer by hybrid bond interconnects; and an optical component optically coupled to the interposer, wherein the optical component is optically coupled to the PIC by an optical pathway through the interposer.