17885338. STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
Contents
STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17885338 titled 'STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS
Simplified Explanation
- Explanation:**
The patent application describes substrates with stress-releasing features, including a core layer, a metallization layer, and a solder mask. The metallization layer has bond pads and the solder mask has openings to release stress during thermal expansions.
- Bullet Points:**
- Substrates with stress-releasing features
- Core layer, metallization layer, and solder mask
- Metallization layer with bond pads
- Solder mask with openings for stress release during thermal expansions
- Potential Applications:**
- Electronics manufacturing
- Circuit board assembly
- Semiconductor packaging
- Problems Solved:**
- Stress accumulation during thermal expansions
- Potential damage to bond pads and conductive structures
- Benefits:**
- Improved reliability of electronic components
- Enhanced performance of circuit boards
- Increased lifespan of semiconductor devices
Original Abstract Submitted
Substrates having stress-releasing features, and associated systems and methods are disclosed herein. In some embodiments, the substrate includes a core layer, a metallization layer formed on an outer surface of the core layer, and a solder mask formed over the metallization layer and the outer surface. The metallization layer can include at least one bond pad and the solder mask can include a first opening exposing the bond pad. The first opening can be surrounded by a bonding region of the solder mask that thermally interfaces with the bond pad and/or any conductive structure bonded thereon. The solder mask can also include one or more second openings adjacent the first opening. Each of the second openings provides space for the solder mask to expand into to release stress due to thermal expansions of the bond pad, the solder mask, and/or the conductive structure during manufacturing and/or operation.
