Pages that link to "Category:Nitin A. Deshpande of Chandler AZ (US)"
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The following pages link to Category:Nitin A. Deshpande of Chandler AZ (US):
View (previous 50 | next 50) (20 | 50 | 100 | 250 | 500)- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation) (← links)
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- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) (← links)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240136292). MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (← links)
- 18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240272388). ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC INTEGRATED CIRCUIT (PIC) simplified abstract (← links)
- Intel corporation (20240319437). PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN simplified abstract (← links)