Samsung electronics co., ltd. (20240259008). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Jooyoung Song of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240259008 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a clamping circuit, a driving circuit, and a gate-off circuit to protect against electrostatic discharge events.
- The semiconductor device features a first power pad, a second power pad, and a signal pad for power and signal transmission.
- A clamping circuit is connected between the first and second power pads to regulate voltage levels.
- The driving circuit, connected to the signal pad, consists of a pull-up circuit and a pull-down circuit for signal control.
- A first gate-off circuit is linked to the pull-down circuit to manage current flow during electrostatic discharge events.
- The first gate-off circuit connects the gate and source of the pull-down circuit to each other to divert high voltage to the clamping circuit.
Potential Applications: - This technology can be applied in various semiconductor devices to protect against electrostatic discharge damage. - It can be used in integrated circuits, microcontrollers, and other electronic components to enhance reliability.
Problems Solved: - Prevents damage to semiconductor devices from electrostatic discharge events. - Ensures stable operation of electronic components in high-voltage environments.
Benefits: - Increased reliability and longevity of semiconductor devices. - Enhanced protection against voltage spikes and electrostatic discharge. - Improved performance in demanding operating conditions.
Commercial Applications: Title: Semiconductor Device with Enhanced Electrostatic Discharge Protection This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial control systems to improve product durability and reliability.
Prior Art: Readers can explore prior patents related to electrostatic discharge protection in semiconductor devices by searching for relevant IPC codes such as H01L 27/02 (ESD protection circuits).
Frequently Updated Research: Researchers are constantly developing new techniques and materials to enhance electrostatic discharge protection in semiconductor devices. Stay updated on the latest advancements in this field for improved device performance.
Questions about Semiconductor Device with Enhanced Electrostatic Discharge Protection: 1. How does the clamping circuit in the semiconductor device regulate voltage levels during electrostatic discharge events? 2. What are the potential implications of this technology for the semiconductor industry in terms of product reliability and performance?
Original Abstract Submitted
a semiconductor device is provided. the semiconductor device includes: a first power pad; a second power pad; a signal pad; a clamping circuit connected between the first power pad and the second power pad; a driving circuit connected to the signal pad and including a pull-up circuit and a pull-down circuit; and a first gate-off circuit connected to the pull-down circuit. the first gate-off circuit is configured to connect a gate of the pull-down circuit and a source of the pull-down circuit to each other during an electrostatic discharge (esd) event in which a high voltage is applied to the signal pad, and control a current generated by the high voltage to flow to the clamping circuit.
