18280545. Composition simplified abstract (LG CHEM, LTD.)
Contents
Composition
Organization Name
Inventor(s)
Jeong Hyun Lee of Daejeon (KR)
Composition - A simplified explanation of the abstract
This abstract first appeared for US patent application 18280545 titled 'Composition
The composition described in the abstract is a room temperature curable material that can be used as a heat dissipation material with appropriate hardness, low adhesion force, and excellent thermal conductivity.
- The composition achieves low adhesion force without the need for a plasticizer or with minimized use of a plasticizer.
- The cured body of the composition can be used in products for various applications.
Potential Applications: - Electronic devices for heat dissipation - Automotive components for thermal management - Industrial equipment for temperature control
Problems Solved: - Providing a heat dissipation material with low adhesion force - Achieving appropriate hardness and excellent thermal conductivity without the use of plasticizers
Benefits: - Improved heat dissipation performance - Enhanced thermal management capabilities - Reduced adhesion force for easier handling
Commercial Applications: - Manufacturing of electronic devices - Automotive industry for thermal solutions - Industrial sector for heat management products
Prior Art: Readers can start searching for prior art related to this technology in the field of thermal interface materials and heat dissipation solutions.
Frequently Updated Research: Stay updated on the latest advancements in room temperature curable materials for heat dissipation applications.
Questions about the composition: 1. How does the composition achieve low adhesion force without using a plasticizer? 2. What are the potential long-term benefits of using this room temperature curable material for heat dissipation?
Original Abstract Submitted
A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using a plasticizer or the like, or in a state where even if the plasticizer is used, the use ratio thereof is minimized. A product containing the composition, or a cured body thereof is also provided.
