18255239. ANTENNA MODULE simplified abstract (LG INNOTEK CO., LTD.)
Contents
ANTENNA MODULE
Organization Name
Inventor(s)
ANTENNA MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18255239 titled 'ANTENNA MODULE
Simplified Explanation
The antenna module described in the patent application includes a first printed circuit board with a circuit pattern, an IC chip, a solder part, a dielectric layer surrounding the IC chip and solder part, and an antenna patterned on the dielectric layer connected to the solder part. The solder part protrudes higher than the dielectric layer.
- The antenna module includes a first printed circuit board with a circuit pattern.
- An IC chip is placed on the first printed circuit board.
- A solder part is positioned on the first printed circuit board.
- A dielectric layer surrounds the IC chip and solder part on the first printed circuit board.
- An antenna is patterned on the upper surface of the dielectric layer and connected to the solder part.
- At least a portion of the solder part protrudes higher than the upper surface of the dielectric layer.
Potential Applications
The technology described in this patent application could be applied in:
- Wireless communication devices
- IoT devices
- RFID systems
Problems Solved
This technology helps in:
- Enhancing signal transmission and reception
- Improving the efficiency of wireless communication devices
Benefits
The benefits of this technology include:
- Compact design
- Improved signal quality
- Enhanced performance of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Mobile phones
- Smart home devices
- Wearable technology
Possible Prior Art
One possible prior art for this technology could be:
- Antenna modules with dielectric layers and solder parts from previous patents
What are the specific dimensions of the antenna module described in the patent application?
The specific dimensions of the antenna module are not provided in the abstract. Further details in the full patent application may include this information.
How does the protrusion of the solder part above the dielectric layer impact the performance of the antenna module?
The abstract does not mention how the protrusion of the solder part above the dielectric layer impacts the performance of the antenna module. This could be a point of interest for further investigation or analysis.
Original Abstract Submitted
An antenna module comprises: a first printed circuit board including a circuit pattern; an IC chip disposed on the first printed circuit board; a solder part disposed on the first printed circuit board; a dielectric layer disposed on the first printed circuit board and surrounding the IC chip and the solder part; and an antenna patterned on the upper surface of the dielectric layer and connected to the solder part, wherein at least a portion of the solder part protrudes up higher than the upper surface of the dielectric layer.
