Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract
Contents
- 1 METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
Organization Name
Inventor(s)
Gianni Signorini of Garching bei Muenchen (DE)
Georg Seidemann of Landshut (DE)
Bernd Waidhas of Pettendorf (DE)
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128202 titled 'METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
Simplified Explanation
The abstract describes electronic packages with conformal shields and methods of forming such packages. Here is a simplified explanation of the patent application:
- The electronic package includes a die with a first surface, a second surface, and sidewall surfaces.
- A redistribution layer with a first conductive layer is over the first surface of the die.
- An under ball metallization (UBM) layer is over the redistribution layer.
- A conductive shield is over the sidewall surfaces and the second surface of the die, electrically coupled to the UBM layer.
Potential Applications
The technology described in this patent application could be applied in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in providing electromagnetic interference (EMI) shielding for electronic components, reducing signal interference and improving overall device performance.
Benefits
The conformal shields improve the reliability and durability of electronic packages by protecting them from external electromagnetic interference. This can lead to enhanced device performance and longevity.
Potential Commercial Applications
One potential commercial application of this technology could be in the telecommunications industry, where electronic devices require high levels of EMI shielding to ensure reliable communication.
Possible Prior Art
One possible prior art for this technology could be existing methods of applying EMI shielding to electronic components, such as using metal enclosures or coatings to protect against interference.
Unanswered Questions
How does the size of the conductive shield impact the overall performance of the electronic package?
The size of the conductive shield could potentially affect the level of EMI shielding provided and the overall efficiency of the electronic package in reducing signal interference.
What are the potential challenges in integrating conformal shields into existing electronic packaging processes?
Integrating conformal shields into existing electronic packaging processes may pose challenges in terms of compatibility, cost, and manufacturing complexity. It would be important to address these challenges to ensure successful implementation of the technology.
Original Abstract Submitted
embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. in an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. a redistribution layer is over the first surface of the die, and the redistribution layer comprises a first conductive layer. in an embodiment, an under ball metallization (ubm) layer is over the redistribution layer, and a conductive shield is over the sidewall surfaces of the die and the second surface of the die. in an embodiment, the conductive shield is electrically coupled to the ubm layer.