Intel corporation (20240355745). POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES simplified abstract
Contents
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
Organization Name
Inventor(s)
Zhiguo Qian of Chandler AZ (US)
Jianyong Xie of Chandler AZ (US)
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355745 titled 'POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
The abstract of the patent application describes methods and structures for joining package structures, including a die on a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure through a portion of the interconnect bridge, electrically and physically coupled to the die.
- Die disposed on a surface of a substrate
- Interconnect bridge embedded in the substrate
- At least one vertical interconnect structure through a portion of the interconnect bridge
- Vertical interconnect structure electrically and physically coupled to the die
- Innovative method of joining package structures
Potential Applications: - Semiconductor packaging - Integrated circuits - Electronics manufacturing
Problems Solved: - Improved electrical and physical coupling of components - Enhanced reliability and performance of package structures
Benefits: - Increased efficiency in package assembly - Enhanced overall product quality - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be applied in the semiconductor industry for the production of high-performance electronic devices, leading to improved market competitiveness and product offerings.
Questions about the technology: 1. How does this technology improve the reliability of package structures? - This technology enhances the electrical and physical coupling of components, leading to increased reliability and performance. 2. What are the potential cost savings associated with implementing this innovative method? - By streamlining the package assembly process and improving overall product quality, this technology can result in cost-effective manufacturing solutions.
Original Abstract Submitted
methods/structures of joining package structures are described. those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.
