Cite This Page
Bibliographic details for Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
- Page name: Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 11 April 2024 04:15 UTC
- Date retrieved: 27 September 2024 15:38 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739
- Page Version ID: 47739
Citation styles for Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
APA style
Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract. (2024, April 11). WikiPatents, . Retrieved 15:38, September 27, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739.
MLA style
"Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract." WikiPatents, . 11 Apr 2024, 04:15 UTC. 27 Sep 2024, 15:38 <http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739>.
MHRA style
WikiPatents contributors, 'Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract', WikiPatents, , 11 April 2024, 04:15 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739> [accessed 27 September 2024]
Chicago style
WikiPatents contributors, "Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739 (accessed September 27, 2024).
CBE/CSE style
WikiPatents contributors. Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract [Internet]. WikiPatents, ; 2024 Apr 11, 04:15 UTC [cited 2024 Sep 27]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739.
Bluebook style
Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739 (last visited September 27, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739", note = "[Online; accessed 27-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240105621)._DIE_INTERCONNECT_SUBSTRATE,_AN_ELECTRICAL_DEVICE_AND_A_METHOD_FOR_FORMING_A_DIE_INTERCONNECT_SUBSTRATE_simplified_abstract&oldid=47739}", note = "[Online; accessed 27-September-2024]" }