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Bibliographic details for Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract

Citation styles for Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract

APA style

Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract. (2024, April 11). WikiPatents, . Retrieved 11:45, September 27, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637.

MLA style

"Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract." WikiPatents, . 11 Apr 2024, 04:10 UTC. 27 Sep 2024, 11:45 <http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract', WikiPatents, , 11 April 2024, 04:10 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637> [accessed 27 September 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637 (accessed September 27, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract [Internet]. WikiPatents, ; 2024 Apr 11, 04:10 UTC [cited 2024 Sep 27]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637.

Bluebook style

Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637 (last visited September 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637",
   note = "[Online; accessed 27-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240113075)._MULTICHIP_IC_DEVICES_WITH_DIE_EMBEDDED_IN_GLASS_SUBSTRATE_%26_A_REDISTRIBUTION_LAYER_INTERCONNECT_BRIDGE_simplified_abstract&oldid=47637}",
   note = "[Online; accessed 27-September-2024]"
 }


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