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Bibliographic details for Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract

Citation styles for Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract

APA style

Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract. (2024, April 11). WikiPatents, . Retrieved 12:03, September 27, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618.

MLA style

"Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract." WikiPatents, . 11 Apr 2024, 04:09 UTC. 27 Sep 2024, 12:03 <http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract', WikiPatents, , 11 April 2024, 04:09 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618> [accessed 27 September 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618 (accessed September 27, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract [Internet]. WikiPatents, ; 2024 Apr 11, 04:09 UTC [cited 2024 Sep 27]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618.

Bluebook style

Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618 (last visited September 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618",
   note = "[Online; accessed 27-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240113029)._MULTICHIP_IC_DEVICES_IN_GLASS_MEDIUM_%26_INCLUDING_AN_INTERCONNECT_BRIDGE_DIE_simplified_abstract&oldid=47618}",
   note = "[Online; accessed 27-September-2024]"
 }


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