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Bibliographic details for 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- Page name: 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 January 2024 05:57 UTC
- Date retrieved: 27 September 2024 12:23 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680
- Page Version ID: 16680
Citation styles for 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
APA style
17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 12:23, September 27, 2024 from http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680.
MLA style
"17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:57 UTC. 27 Sep 2024, 12:23 <http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680>.
MHRA style
WikiPatents contributors, '17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:57 UTC, <http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680> [accessed 27 September 2024]
Chicago style
WikiPatents contributors, "17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680 (accessed September 27, 2024).
CBE/CSE style
WikiPatents contributors. 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:57 UTC [cited 2024 Sep 27]. Available from: http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680.
Bluebook style
17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680 (last visited September 27, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680", note = "[Online; accessed 27-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680}", note = "[Online; accessed 27-September-2024]" }