Difference between revisions of "Applied Materials, Inc. patent applications published on November 30th, 2023"
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==Patent applications for Applied Materials, Inc. on November 30th, 2023== | ==Patent applications for Applied Materials, Inc. on November 30th, 2023== | ||
− | ===DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION ([[US Patent Application 18365527. DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION simplified abstract|18365527]])=== | + | ===DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION ([[US Patent Application 18365527. DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION simplified abstract (Applied Materials, Inc.)|18365527]])=== |
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− | ===OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING ([[US Patent Application 17968608. OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract|17968608]])=== | + | ===OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING ([[US Patent Application 17968608. OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract (Applied Materials, Inc.)|17968608]])=== |
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− | ===CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING ([[US Patent Application 17968597. CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract|17968597]])=== | + | ===CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING ([[US Patent Application 17968597. CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract (Applied Materials, Inc.)|17968597]])=== |
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− | ===GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES ([[US Patent Application 17974280. GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES simplified abstract|17974280]])=== | + | ===GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES ([[US Patent Application 17974280. GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES simplified abstract (Applied Materials, Inc.)|17974280]])=== |
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− | ===MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS ([[US Patent Application 18232421. MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS simplified abstract|18232421]])=== | + | ===MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS ([[US Patent Application 18232421. MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS simplified abstract (Applied Materials, Inc.)|18232421]])=== |
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− | ===METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE ([[US Patent Application 18143747. METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE simplified abstract|18143747]])=== | + | ===METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE ([[US Patent Application 18143747. METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE simplified abstract (Applied Materials, Inc.)|18143747]])=== |
Line 77: | Line 49: | ||
− | ===METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE ([[US Patent Application 17824282. METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE simplified abstract|17824282]])=== | + | ===METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE ([[US Patent Application 17824282. METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE simplified abstract (Applied Materials, Inc.)|17824282]])=== |
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− | ===SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE ([[US Patent Application 17827204. SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE simplified abstract|17827204]])=== | + | ===SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE ([[US Patent Application 17827204. SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE simplified abstract (Applied Materials, Inc.)|17827204]])=== |
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− | ===GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE ([[US Patent Application 18303370. GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE simplified abstract|18303370]])=== | + | ===GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE ([[US Patent Application 18303370. GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE simplified abstract (Applied Materials, Inc.)|18303370]])=== |
Line 101: | Line 73: | ||
− | ===PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY ([[US Patent Application 17871455. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract|17871455]])=== | + | ===PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY ([[US Patent Application 17871455. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract (Applied Materials, Inc.)|17871455]])=== |
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− | ===PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY ([[US Patent Application 17871505. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract|17871505]])=== | + | ===PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY ([[US Patent Application 17871505. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract (Applied Materials, Inc.)|17871505]])=== |
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− | ===SITU CLEAN FOR BEVEL AND EDGE RING ([[US Patent Application 17829288. SITU CLEAN FOR BEVEL AND EDGE RING simplified abstract|17829288]])=== | + | ===SITU CLEAN FOR BEVEL AND EDGE RING ([[US Patent Application 17829288. SITU CLEAN FOR BEVEL AND EDGE RING simplified abstract (Applied Materials, Inc.)|17829288]])=== |
Line 125: | Line 97: | ||
− | ===LOW TEMPERATURE SILICON OXIDE GAP FILL ([[US Patent Application 17827652. LOW TEMPERATURE SILICON OXIDE GAP FILL simplified abstract|17827652]])=== | + | ===LOW TEMPERATURE SILICON OXIDE GAP FILL ([[US Patent Application 17827652. LOW TEMPERATURE SILICON OXIDE GAP FILL simplified abstract (Applied Materials, Inc.)|17827652]])=== |
Line 133: | Line 105: | ||
− | ===HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES ([[US Patent Application 17827356. HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES simplified abstract|17827356]])=== | + | ===HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES ([[US Patent Application 17827356. HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES simplified abstract (Applied Materials, Inc.)|17827356]])=== |
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− | ===SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER ([[US Patent Application 17824889. SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER simplified abstract|17824889]])=== | + | ===SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER ([[US Patent Application 17824889. SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER simplified abstract (Applied Materials, Inc.)|17824889]])=== |
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− | ===DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS ([[US Patent Application 18082872. DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS simplified abstract|18082872]])=== | + | ===DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS ([[US Patent Application 18082872. DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS simplified abstract (Applied Materials, Inc.)|18082872]])=== |
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− | ===METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE ([[US Patent Application 18233751. METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE simplified abstract|18233751]])=== | + | ===METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE ([[US Patent Application 18233751. METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE simplified abstract (Applied Materials, Inc.)|18233751]])=== |
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− | ===FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING ([[US Patent Application 17974281. FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING simplified abstract|17974281]])=== | + | ===FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING ([[US Patent Application 17974281. FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING simplified abstract (Applied Materials, Inc.)|17974281]])=== |
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− | ===OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME ([[US Patent Application 17985632. OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME simplified abstract|17985632]])=== | + | ===OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME ([[US Patent Application 17985632. OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME simplified abstract (Applied Materials, Inc.)|17985632]])=== |
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− | ===SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF ([[US Patent Application 18231414. SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF simplified abstract|18231414]])=== | + | ===SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF ([[US Patent Application 18231414. SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF simplified abstract (Applied Materials, Inc.)|18231414]])=== |
Revision as of 07:05, 5 December 2023
Contents
- 1 Patent applications for Applied Materials, Inc. on November 30th, 2023
- 1.1 DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION (18365527)
- 1.2 OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968608)
- 1.3 CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968597)
- 1.4 GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES (17974280)
- 1.5 MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS (18232421)
- 1.6 METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE (18143747)
- 1.7 METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE (17824282)
- 1.8 SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE (17827204)
- 1.9 GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE (18303370)
- 1.10 PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871455)
- 1.11 PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871505)
- 1.12 SITU CLEAN FOR BEVEL AND EDGE RING (17829288)
- 1.13 LOW TEMPERATURE SILICON OXIDE GAP FILL (17827652)
- 1.14 HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES (17827356)
- 1.15 SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER (17824889)
- 1.16 DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS (18082872)
- 1.17 METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE (18233751)
- 1.18 FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING (17974281)
- 1.19 OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME (17985632)
- 1.20 SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF (18231414)
Patent applications for Applied Materials, Inc. on November 30th, 2023
DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION (18365527)
Main Inventor
Kun Xu
OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968608)
Main Inventor
Steven M. Zuniga
CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968597)
Main Inventor
Steven M. Zuniga
GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES (17974280)
Main Inventor
Chad Pollard
MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS (18232421)
Main Inventor
Chandan Kr Barik
METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE (18143747)
Main Inventor
Jinxin FU
METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE (17824282)
Main Inventor
Jui-Che Lin
SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE (17827204)
Main Inventor
Tyler Wills
GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE (18303370)
Main Inventor
Frank Sinclair
PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871455)
Main Inventor
Zhepeng CONG
PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871505)
Main Inventor
Zhepeng CONG
SITU CLEAN FOR BEVEL AND EDGE RING (17829288)
Main Inventor
Kaushik ALAYAVALLI
LOW TEMPERATURE SILICON OXIDE GAP FILL (17827652)
Main Inventor
Soham Asrani
HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES (17827356)
Main Inventor
Xiaolin C. Chen
SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER (17824889)
Main Inventor
Liqi Wu
DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS (18082872)
Main Inventor
Lakmal Charidu Kalutarage
METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE (18233751)
Main Inventor
Liangfa HU
FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING (17974281)
Main Inventor
Chad Pollard
OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME (17985632)
Main Inventor
Chung-Chia Chen
SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF (18231414)
Main Inventor
Minrui YU