Difference between revisions of "Applied Materials, Inc. patent applications published on November 30th, 2023"
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+ | '''Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023''' | ||
+ | |||
+ | Applied Materials, Inc. has recently filed several patents related to various aspects of semiconductor device processing and manufacturing. These patents cover topics such as spin-orbit torque magnetoresistive random-access memory (SOT-MRAM) devices, OLED device processing, chemical mechanical polishing assemblies, substrate backside damage reduction, metal oxo photoresist deposition, selective metal removal, semiconductor processing using oxygen-containing and halide precursors, flowable silicon film for gap filling, cleaning bevel areas of substrate supports, and flow guides for semiconductor manufacturing. | ||
+ | |||
+ | Summary: | ||
+ | - Applied Materials, Inc. has filed patents for spin-orbit torque magnetoresistive random-access memory (SOT-MRAM) devices and their manufacturing methods. | ||
+ | - They have also filed patents for methods of processing OLED devices, including the formation of anode layers using metal oxide materials and protective barriers. | ||
+ | - Patents have been filed for chemical mechanical polishing assemblies, including fluid delivery conduits with conductive wires for electrostatic discharge. | ||
+ | - Applied Materials, Inc. has filed patents for reducing substrate backside damage during semiconductor device processing, including plasma preheat treatments and improved substrate support designs. | ||
+ | - They have also filed patents for depositing metal oxo photoresist films using dry deposition processes, eliminating the need for wet chemical processes. | ||
+ | - Patents have been filed for selectively removing metal material from feature surfaces and sidewalls, as well as for semiconductor processing using oxygen-containing and halide precursors. | ||
+ | - Applied Materials, Inc. has filed patents for filling gaps within substrate features using flowable silicon films, cleaning bevel areas of substrate supports, and flow guides for deposition process adjustability in semiconductor manufacturing. | ||
+ | |||
+ | Notable Applications: | ||
+ | * SOT-MRAM devices and manufacturing methods. | ||
+ | * OLED device processing methods. | ||
+ | * Chemical mechanical polishing assemblies with electrostatic discharge capabilities. | ||
+ | * Substrate backside damage reduction during semiconductor processing. | ||
+ | * Metal oxo photoresist deposition using dry processes. | ||
+ | * Selective metal removal from feature surfaces and sidewalls. | ||
+ | * Semiconductor processing using oxygen-containing and halide precursors. | ||
+ | * Flowable silicon film for gap filling in substrate features. | ||
+ | * Cleaning bevel areas of substrate supports in plasma processing chambers. | ||
+ | * Flow guides for deposition process adjustability in semiconductor manufacturing. | ||
+ | |||
+ | |||
+ | |||
+ | |||
==Patent applications for Applied Materials, Inc. on November 30th, 2023== | ==Patent applications for Applied Materials, Inc. on November 30th, 2023== | ||
+ | |||
+ | ===DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION ([[US Patent Application 18365527. DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION simplified abstract (Applied Materials, Inc.)|18365527]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Kun Xu | ||
+ | |||
+ | |||
+ | ===OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING ([[US Patent Application 17968608. OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract (Applied Materials, Inc.)|17968608]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Steven M. Zuniga | ||
+ | |||
+ | |||
+ | ===CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING ([[US Patent Application 17968597. CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract (Applied Materials, Inc.)|17968597]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Steven M. Zuniga | ||
+ | |||
+ | |||
+ | ===GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES ([[US Patent Application 17974280. GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES simplified abstract (Applied Materials, Inc.)|17974280]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Chad Pollard | ||
+ | |||
+ | |||
+ | ===MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS ([[US Patent Application 18232421. MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS simplified abstract (Applied Materials, Inc.)|18232421]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Chandan Kr Barik | ||
+ | |||
+ | |||
+ | ===METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE ([[US Patent Application 18143747. METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE simplified abstract (Applied Materials, Inc.)|18143747]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Jinxin FU | ||
+ | |||
+ | |||
+ | ===METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE ([[US Patent Application 17824282. METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE simplified abstract (Applied Materials, Inc.)|17824282]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Jui-Che Lin | ||
+ | |||
+ | |||
+ | ===SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE ([[US Patent Application 17827204. SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE simplified abstract (Applied Materials, Inc.)|17827204]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Tyler Wills | ||
+ | |||
+ | |||
+ | ===GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE ([[US Patent Application 18303370. GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE simplified abstract (Applied Materials, Inc.)|18303370]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Frank Sinclair | ||
+ | |||
+ | |||
+ | ===PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY ([[US Patent Application 17871455. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract (Applied Materials, Inc.)|17871455]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Zhepeng CONG | ||
+ | |||
+ | |||
+ | ===PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY ([[US Patent Application 17871505. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract (Applied Materials, Inc.)|17871505]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Zhepeng CONG | ||
+ | |||
+ | |||
+ | ===SITU CLEAN FOR BEVEL AND EDGE RING ([[US Patent Application 17829288. SITU CLEAN FOR BEVEL AND EDGE RING simplified abstract (Applied Materials, Inc.)|17829288]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Kaushik ALAYAVALLI | ||
+ | |||
+ | |||
+ | ===LOW TEMPERATURE SILICON OXIDE GAP FILL ([[US Patent Application 17827652. LOW TEMPERATURE SILICON OXIDE GAP FILL simplified abstract (Applied Materials, Inc.)|17827652]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Soham Asrani | ||
+ | |||
+ | |||
+ | ===HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES ([[US Patent Application 17827356. HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES simplified abstract (Applied Materials, Inc.)|17827356]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Xiaolin C. Chen | ||
+ | |||
+ | |||
+ | ===SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER ([[US Patent Application 17824889. SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER simplified abstract (Applied Materials, Inc.)|17824889]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Liqi Wu | ||
+ | |||
+ | |||
+ | ===DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS ([[US Patent Application 18082872. DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS simplified abstract (Applied Materials, Inc.)|18082872]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Lakmal Charidu Kalutarage | ||
+ | |||
+ | |||
+ | ===METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE ([[US Patent Application 18233751. METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE simplified abstract (Applied Materials, Inc.)|18233751]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Liangfa HU | ||
+ | |||
+ | |||
+ | ===FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING ([[US Patent Application 17974281. FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING simplified abstract (Applied Materials, Inc.)|17974281]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Chad Pollard | ||
+ | |||
+ | |||
+ | ===OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME ([[US Patent Application 17985632. OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME simplified abstract (Applied Materials, Inc.)|17985632]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Chung-Chia Chen | ||
+ | |||
+ | |||
+ | ===SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF ([[US Patent Application 18231414. SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF simplified abstract (Applied Materials, Inc.)|18231414]])=== | ||
+ | |||
+ | |||
+ | '''Main Inventor''' | ||
+ | |||
+ | Minrui YU |
Latest revision as of 06:38, 7 December 2023
Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023
Applied Materials, Inc. has recently filed several patents related to various aspects of semiconductor device processing and manufacturing. These patents cover topics such as spin-orbit torque magnetoresistive random-access memory (SOT-MRAM) devices, OLED device processing, chemical mechanical polishing assemblies, substrate backside damage reduction, metal oxo photoresist deposition, selective metal removal, semiconductor processing using oxygen-containing and halide precursors, flowable silicon film for gap filling, cleaning bevel areas of substrate supports, and flow guides for semiconductor manufacturing.
Summary: - Applied Materials, Inc. has filed patents for spin-orbit torque magnetoresistive random-access memory (SOT-MRAM) devices and their manufacturing methods. - They have also filed patents for methods of processing OLED devices, including the formation of anode layers using metal oxide materials and protective barriers. - Patents have been filed for chemical mechanical polishing assemblies, including fluid delivery conduits with conductive wires for electrostatic discharge. - Applied Materials, Inc. has filed patents for reducing substrate backside damage during semiconductor device processing, including plasma preheat treatments and improved substrate support designs. - They have also filed patents for depositing metal oxo photoresist films using dry deposition processes, eliminating the need for wet chemical processes. - Patents have been filed for selectively removing metal material from feature surfaces and sidewalls, as well as for semiconductor processing using oxygen-containing and halide precursors. - Applied Materials, Inc. has filed patents for filling gaps within substrate features using flowable silicon films, cleaning bevel areas of substrate supports, and flow guides for deposition process adjustability in semiconductor manufacturing.
Notable Applications:
- SOT-MRAM devices and manufacturing methods.
- OLED device processing methods.
- Chemical mechanical polishing assemblies with electrostatic discharge capabilities.
- Substrate backside damage reduction during semiconductor processing.
- Metal oxo photoresist deposition using dry processes.
- Selective metal removal from feature surfaces and sidewalls.
- Semiconductor processing using oxygen-containing and halide precursors.
- Flowable silicon film for gap filling in substrate features.
- Cleaning bevel areas of substrate supports in plasma processing chambers.
- Flow guides for deposition process adjustability in semiconductor manufacturing.
Contents
- 1 Patent applications for Applied Materials, Inc. on November 30th, 2023
- 1.1 DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION (18365527)
- 1.2 OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968608)
- 1.3 CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968597)
- 1.4 GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES (17974280)
- 1.5 MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS (18232421)
- 1.6 METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE (18143747)
- 1.7 METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE (17824282)
- 1.8 SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE (17827204)
- 1.9 GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE (18303370)
- 1.10 PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871455)
- 1.11 PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871505)
- 1.12 SITU CLEAN FOR BEVEL AND EDGE RING (17829288)
- 1.13 LOW TEMPERATURE SILICON OXIDE GAP FILL (17827652)
- 1.14 HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES (17827356)
- 1.15 SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER (17824889)
- 1.16 DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS (18082872)
- 1.17 METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE (18233751)
- 1.18 FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING (17974281)
- 1.19 OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME (17985632)
- 1.20 SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF (18231414)
Patent applications for Applied Materials, Inc. on November 30th, 2023
DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION (18365527)
Main Inventor
Kun Xu
OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968608)
Main Inventor
Steven M. Zuniga
CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING (17968597)
Main Inventor
Steven M. Zuniga
GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES (17974280)
Main Inventor
Chad Pollard
MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS (18232421)
Main Inventor
Chandan Kr Barik
METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDE (18143747)
Main Inventor
Jinxin FU
METHODS AND MECHANISMS FOR PREVENTING FLUCTUATION IN MACHINE-LEARNING MODEL PERFORMANCE (17824282)
Main Inventor
Jui-Che Lin
SYSTEMS AND METHODS FOR OPTIMIZING FULL HORIZONTAL SCANNED BEAM DISTANCE (17827204)
Main Inventor
Tyler Wills
GA IMPLANT PROCESS CONTROL FOR ENHANCED PARTICLE PERFORMANCE (18303370)
Main Inventor
Frank Sinclair
PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871455)
Main Inventor
Zhepeng CONG
PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY (17871505)
Main Inventor
Zhepeng CONG
SITU CLEAN FOR BEVEL AND EDGE RING (17829288)
Main Inventor
Kaushik ALAYAVALLI
LOW TEMPERATURE SILICON OXIDE GAP FILL (17827652)
Main Inventor
Soham Asrani
HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEATURES (17827356)
Main Inventor
Xiaolin C. Chen
SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER (17824889)
Main Inventor
Liqi Wu
DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS (18082872)
Main Inventor
Lakmal Charidu Kalutarage
METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE (18233751)
Main Inventor
Liangfa HU
FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING (17974281)
Main Inventor
Chad Pollard
OLED ANODE STRUCTURES INCLUDING AMORPHOUS TRANSPARENT CONDUCTING OXIDES AND OLED PROCESSING METHOD COMPRISING THE SAME (17985632)
Main Inventor
Chung-Chia Chen
SPIN-ORBIT TORQUE MRAM STRUCTURE AND MANUFACTURE THEREOF (18231414)
Main Inventor
Minrui YU