View source for ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME: abstract simplified (18335383)

*This abstract for appeared for patent application  number 18335383 Titled 'ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME'

==Simplified Explanation==

The abstract describes an electronic component mounting structure that includes a circuit board with a first electrode containing copper (Cu) and an electronic component with a second electrode. The second electrode consists of a first plating containing nickel (Ni) and a second plating containing tin (Sn). An intermediate bonding layer is present between the first plating and the first electrode, which includes a first region containing a copper-tin (Cu-Sn) alloy and a second region containing tin.


==Original Abstract Submitted==

The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component formed on a surface of the first plating, and an intermediate bonding layer is provided between the first plating and the first electrode, and the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.