View source for 18054021. PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)

=PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE=


==Organization Name==

[[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]


[[Category:CANON KABUSHIKI KAISHA]]

==Inventor(s)==

[[:Category:Masami Yonekawa of Tochigi (JP)|Masami Yonekawa of Tochigi (JP)]][[Category:Masami Yonekawa of Tochigi (JP)]]

[[:Category:Tomohiro Saito of Tochigi (JP)|Tomohiro Saito of Tochigi (JP)]][[Category:Tomohiro Saito of Tochigi (JP)]]

[[:Category:Hisanobu Azuma of Kanagawa (JP)|Hisanobu Azuma of Kanagawa (JP)]][[Category:Hisanobu Azuma of Kanagawa (JP)]]

==PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18054021 titled 'PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE

==Simplified Explanation==

'''Abstract:'''
A curable composition is applied to a substrate and cured while in contact with a member. The member is then separated from the substrate, removing the cured composition and any particles present.

* The curable composition is applied to a substrate.
* A member is placed in contact with the curable composition.
* The composition is cured while the member is in contact with it.
* The member is separated from the substrate.
* The cured composition and any particles are removed from the substrate.

'''Potential Applications:'''
* Manufacturing processes where the removal of cured compositions and particles from a substrate is required.
* Coating applications where a member is used to facilitate the curing process.

'''Problems Solved:'''
* Efficient removal of cured compositions and particles from a substrate.
* Simplification of manufacturing processes involving curable compositions.

'''Benefits:'''
* Improved cleanliness and quality of the substrate after the removal of cured compositions and particles.
* Streamlined manufacturing processes, reducing time and costs.


==Original Abstract Submitted==

A curable composition on a substrate is cured in a state where a member is in contact with the curable composition. Thereafter, the member having adhered to the curable composition is separated from the substrate, whereby the curable composition and a particle are removed from the substrate.



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