View source for 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)

=INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Srinivasan Raman of Chandler AZ (US)|Srinivasan Raman of Chandler AZ (US)]][[Category:Srinivasan Raman of Chandler AZ (US)]]

[[:Category:Brandon C. Marin of Gilbert AZ (US)|Brandon C. Marin of Gilbert AZ (US)]][[Category:Brandon C. Marin of Gilbert AZ (US)]]

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Benjamin Duong of Phoenix AZ (US)|Benjamin Duong of Phoenix AZ (US)]][[Category:Benjamin Duong of Phoenix AZ (US)]]

[[:Category:Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)|Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)]][[Category:Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)]]

[[:Category:Kripa Chauhan of Santa Clara CA (US)|Kripa Chauhan of Santa Clara CA (US)]][[Category:Kripa Chauhan of Santa Clara CA (US)]]

==INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17957225 titled 'INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS

==Simplified Explanation==

The patent application describes embedded components in glass core layers for semiconductor assemblies. A semiconductor assembly includes a glass core with cavities where components are embedded, partially within the glass core, with a semiconductor die attached to the substrate.

* Glass core layers with embedded components for semiconductor assemblies
* Components embedded in glass core cavities
* Semiconductor die attached to the substrate

== Potential Applications ==
The technology could be applied in:
* Semiconductor manufacturing
* Electronics industry
* Automotive sector

== Problems Solved ==
The technology addresses issues such as:
* Improving semiconductor assembly reliability
* Enhancing component integration
* Increasing overall performance

== Benefits ==
The benefits of this technology include:
* Enhanced durability and stability
* Improved thermal management
* Increased efficiency and functionality

== Potential Commercial Applications ==
The technology could be commercially applied in:
* Semiconductor packaging companies
* Electronics manufacturers
* Automotive electronics suppliers

== Possible Prior Art ==
One possible prior art could be the use of traditional substrate materials for semiconductor assemblies, which may not offer the same level of integration and reliability as glass core layers with embedded components.

== Unanswered Questions ==
=== How does the embedded component affect the overall performance of the semiconductor assembly? ===
The article does not delve into specific details on how the embedded components impact the performance metrics of the semiconductor assembly.

=== What are the specific materials used for the glass core and embedded components? ===
The article does not provide information on the exact materials utilized for the glass core and the components embedded within it.


==Original Abstract Submitted==

Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.



[[Category:H01L23/64]]