View source for 17946146. MEMORY MODULE GUIDANCE AND RETENTION STRUCTURE simplified abstract (International Business Machines Corporation)

=MEMORY MODULE GUIDANCE AND RETENTION STRUCTURE=


==Organization Name==

[[:Category:International Business Machines Corporation|International Business Machines Corporation]]


[[Category:International Business Machines Corporation]]

==Inventor(s)==

[[:Category:NATHAN LEE Dunfee of ROCHESTER MN (US)|NATHAN LEE Dunfee of ROCHESTER MN (US)]][[Category:NATHAN LEE Dunfee of ROCHESTER MN (US)]]

[[:Category:KEVIN O'connell of MANTORVILLE MN (US)|KEVIN O'connell of MANTORVILLE MN (US)]][[Category:KEVIN O'connell of MANTORVILLE MN (US)]]

[[:Category:CHRISTOPHER M. Marroquin of ROCHESTER MN (US)|CHRISTOPHER M. Marroquin of ROCHESTER MN (US)]][[Category:CHRISTOPHER M. Marroquin of ROCHESTER MN (US)]]

[[:Category:STEPHEN P. Mroz of ROCHESTER MN (US)|STEPHEN P. Mroz of ROCHESTER MN (US)]][[Category:STEPHEN P. Mroz of ROCHESTER MN (US)]]

[[:Category:MARK DAVID Pfeifer of OWATONNA MN (US)|MARK DAVID Pfeifer of OWATONNA MN (US)]][[Category:MARK DAVID Pfeifer of OWATONNA MN (US)]]

[[:Category:KENNETH E. Lubahn of ORONOCO MN (US)|KENNETH E. Lubahn of ORONOCO MN (US)]][[Category:KENNETH E. Lubahn of ORONOCO MN (US)]]

[[:Category:JUSTIN CHRISTOPHER Rogers of ROCHESTER MN (US)|JUSTIN CHRISTOPHER Rogers of ROCHESTER MN (US)]][[Category:JUSTIN CHRISTOPHER Rogers of ROCHESTER MN (US)]]

==MEMORY MODULE GUIDANCE AND RETENTION STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17946146 titled 'MEMORY MODULE GUIDANCE AND RETENTION STRUCTURE

==Simplified Explanation==

The apparatus described in the patent application is designed to guide and retain integrated circuit boards during the assembly process. Here are some key points to explain the innovation:

* The apparatus includes a first structure that guides the integrated circuit board for coupling to a substrate.
* A second structure, which can be removed, applies a compressive force to the integrated circuit board using a spring member.
* The design allows for easy and secure positioning of the integrated circuit board during assembly.

== Potential Applications ==
The technology described in the patent application could be used in various industries where integrated circuit boards need to be accurately positioned and secured during assembly processes.

== Problems Solved ==
This technology solves the problem of ensuring the proper alignment and retention of integrated circuit boards during assembly, which can be challenging without the use of specialized tools.

== Benefits ==
The benefits of this technology include increased efficiency in the assembly process, improved accuracy in positioning integrated circuit boards, and reduced risk of damage during assembly.

== Potential Commercial Applications ==
Potential commercial applications of this technology could include electronics manufacturing, telecommunications equipment assembly, and automotive electronics production.

== Possible Prior Art ==
One possible prior art for this technology could be existing apparatus or tools designed for guiding and retaining integrated circuit boards during assembly processes.

=== Unanswered Questions ===

=== How does this apparatus compare to existing solutions in terms of cost-effectiveness? ===
The cost-effectiveness of this apparatus compared to existing solutions is not addressed in the patent application. It would be important to know how the initial investment in this technology compares to the potential savings in time and resources during the assembly process.

=== What materials are used in the construction of the apparatus and how does this affect its durability? ===
The patent application does not provide details on the materials used in the construction of the apparatus or its durability. Understanding the materials used and their impact on the longevity of the apparatus would be important for potential users.


==Original Abstract Submitted==

An apparatus for guidance and retention of integrated circuit boards includes a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate. The apparatus further includes a second structure configured to be removably coupled to the first structure. The second structure includes a first spring member configured to apply a first compressive force to the first integrated circuit board.



[[Category:H01R12/72]]