Taiwan semiconductor manufacturing co., ltd. (20250087638). PACKAGE STRUCTURE
PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chin-Hua Wang of New Taipei City (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Zhudong Township (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
PACKAGE STRUCTURE
This abstract first appeared for US patent application 20250087638 titled 'PACKAGE STRUCTURE
Original Abstract Submitted
a package structure is provided. the package structure includes a first package component mounted on a substrate, a lid structure disposed on the substrate and around the first package component, and a thermal interface material vertically sandwiched between the plurality of integrated circuit dies of the first package component and the lid structure. the first package component includes a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies. the lid structure covers the integrated circuit dies and exposes the underfill. a first portion and a second portion of the thermal interface material are laterally separated from each other, and a space between the first portion and the second portion is exposed from the lid structure.