Contact Hole Assembly and Electronic Device

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Contact Hole Assembly and Electronic Device

This abstract first appeared for US patent application 20250120017 titled 'Contact Hole Assembly and Electronic Device

Original Abstract Submitted

embodiments of the disclosure relate to a contact hole assembly and an electronic device and may, more specifically, provide a contact hole assembly comprising a first metal layer to which an electrical signal is input, an insulation layer formed on the first metal layer, a second metal layer formed on the insulation layer and outputting the electrical signal, and a contact hole electrically connecting the first metal layer and the second metal layer, wherein the contact hole includes a via area penetrating the insulation layer, a conductor formed in the via area, and a recess area where a portion of a surface of the conductor is removed.