ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

Abstract: a liquid cooling system includes a thermoelectric cooler (tec) between a radiator plate and a radiator, and a thermoelectric generator (teg) at a location where the teg is driven by heat from a chip package. the chip package is cooled by a cold plate of the liquid cooling system and the tec is controlled by the teg. the teg may be between the chip package and the cold plate or elsewhere in or adjacent to the chip package. the teg may control the tec through a relay. the teg automatically activates the tec when the chip package is under peak load.

Inventor(s): Chien-Chang Wang, Kuan-Min Wang, Ching Wang, Kuo-Chin Chang, Kathy Wei Yan, Jun He

CPC Classification: H10N10/13 (characterised by the heat-exchanging means at the junction)

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