ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Abstract: an electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. the first substrate has a first surface, a second surface, and a side surface. the first surface is opposite to the second surface. the side surface connects the first surface and the second surface. the first circuit layer is disposed on the first surface. the second circuit layer is disposed on the second surface. the side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. the light-shielding layer is disposed on the side circuit layer. the protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. the protective layer includes an opening exposing a portion of the second circuit layer. the circuit board is electrically connected to the second circuit layer through the opening.

Inventor(s): Tsau-Hua Hsieh, Kuan-Hung Kuo, Chiung-Chieh Kuo, Shu-Han Yu, Yan-Yu Qiu, Bo-Jun Jiang

CPC Classification: H10H29/8552 (No explanation available)

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