SUBSTRATE POLISHING METHOD AND SUBSTRATE POLISHING APPARATUS

Abstract: a first dressing of dressing a polishing member is performed under a plurality of preset set dress conditions, a first cut rate of the polishing member is measured based on a measurement value of a surface height of the polishing member for each set dress condition, and the set dress condition and the first cut rate are associated with each other and stored as relationship data. the substrate is polished by applying a first dress condition corresponding to a target cut rate based on the relationship data, and a second cut rate of the polishing member is measured based on the measurement value of the surface height of polishing member. a second dress condition corresponding to the target cut rate is acquired based on a change of the second cut rate from the target cut rate and the relationship data, and substrate is polished by applying the second dress condition.

Inventor(s): Masashi KABASAWA, Keita YAGI

CPC Classification: B24B49/18 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth , of screw-threads ; by electro-erosion ; abrasive or related blasting ; tools for grinding, buffing or sharpening ; polishing compositions ; abrasives ; electrolytic etching or polishing ; grinding arrangements for use on assembled railway tracks ); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS)

Search for rejections for patent application number 20250178158