SEMICONDUCTOR DEVICE

Abstract: a semiconductor device includes a semiconductor element, a first organic substrate covering an edge of an electrode pad of the semiconductor element, a first wiring layer arranged on an upper surface of the first organic substrate, and a conductive layer formed on a lower surface of the semiconductor element. the semiconductor device further includes a second organic substrate covering an edge of the conductive layer, and an encapsulation resin encapsulating the semiconductor element between the first and second organic substrates. the conductive layer includes an electrode pad. the first organic substrate includes a first substrate body and a first adhesive layer formed on the first substrate body and adhered to the upper surface of the semiconductor element. the second organic substrate includes a second substrate body and a second adhesive layer formed on the second substrate body and adhered to a lower surface of the conductive layer.

Inventor(s): Kei MURAYAMA, Amane KANEKO, Mitsuhiro AIZAWA, Yoichi NISHIHARA, Takumi YUMOTO, Kenichi KOI, Takashi KURIHARA, Koji BANDO, Jumpei TOKUTAKE

CPC Classification: H01L23/145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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